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《Engineering Plastics Application》 2004-07
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ADVANCE IN THE RESEARCH OF HIGH PERFORMANCE COPPER CLAD LAMINATE BASED ON RESIN MATRIX

Zhou Wensheng, Liang Guozheng, Fang Hongqiang, Ren Penggang, Yang Jieying (Department of Applied Chemistry, College of Science, Northwestern Polytechnic University, Xi’an 710072, China)  
The development and recent situation of high performance copper clad laminate based on novel epoxy, bismaleimide, cyanate ester, etc. thermosetting resins and polyphenyl ether, polytetrafluoroethylene polyimide, etc. thermoplastic resins are summarized. The application of novel epoxy system, curing system and its modified agent are mainly discussed. The key of development of copper clad laminates is to strength the research of novel resin which has high performance such as high thermal resistance, excellent dielectric properties, flame retardance and environment protection, anti UV and AOI function.
【CateGory Index】: TQ320.7
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