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《Ordnance Material Science and Engineering》 2001-02
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ADVANCES IN METAL-MATRIX MATERIAL FOR ELECTRONIC PACKAGING

Liu Zhengchun, Wang Zhifa, Jiang Guosheng  
Compared with several traditional metal-matrix electronic packaging materials, the characteristics,fabricating technology,application prospect and existing problems of the new packaging materials such as WCu,MoCu and SiC/Al ect are elaborated in detail.The recent developments of the metal-matrix electronic packaging material are presented.It is pointed out that the recent R D abroad of the electronic packaging material are focused on netshaping technology,new composite system exploring and integrating application of material etc.At last,the developing tendency of the metalmatrix electronic packaging material was forecasted in this paper.The author believes that high performance,low cost,light weight and integration will be the future characteristics of the metalmatrix electronic packaging material.
【Fund】: 国家高新工程重点资助项目
【CateGory Index】: TB34
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