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《Ordnance Material Science and Engineering》 2006-05
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Study on radial friction welding of typical copper-alloy T3、B5、H96 with steel 35CrMnSi

WU Wei1,2,XU Xiao-ling2,XU Yuan-ze2(1.College of Mechanical Engineering,Chongqing University,Chongqing 400044,China; 2.No.59 Institute of China Ordnance Industry,Chongqing 400039,China)  
In order to determine whether the welding properties can meet the operating requirements of the products,the welding properties of three kinds of aldary(T3,B5,H96) with 35CrMnSi by the use of inertial radial friction welding are studied.Experiments have been done such as the microstructure analysis of the welding joint,shear strength and Vickers-hardness test.The results show that T3 copper,B5 cupronickel and H96 brassiness welded with steel possesse high properties.The shear strength of joints reaches more than 200 MPa,and there is no hole flaw which can be often found in fusion welding.The results also indicate that the microstructures of HAZ on B5+35CrMnSi steel side are wider because of the melting point and conduction.The welding properties can satisfy the operating requirements of the products.
【CateGory Index】: TG406
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【Citations】
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【Co-citations】
Chinese Journal Full-text Database 10 Hits
1 LI Bei (The 41st Institute of CETC,Bengbu 233006,China);Structural characteristics of the model polarization maintaining fibers fusion splice[J];Journal of Anhui University of Technology and Science(Natural Science);2008-01
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3 Wang Xiangming Liu Wenting He Xiaofan (Dept. of Flight Vehicle Design and Applied Mechanics, Beijing University of Aeronautics and Astronautics, Beijing 100083, China);Study on the fatigue properties of the TA15 titanium alloy plate and electron beam welding specimen[J];Journal of Beijing University of Aeronautics and Astronautics;2003-09
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8 CHEN Fang, DU Changhua, HUANG Fuxiang, DU Yunfei (College of Material Science and Engineering, Chongqing Institute of Technology, Chongqing 400050; College of Foreign Language, Chongqing University, Chongqing 400044);Development Prospect of Microelectronics Chip Interconnection Technology and Materials[J];Materials Review;2006-05
9 LI Hong,HAN Jing-tao(Material Science & Engineering School,Universityof Science & Technology Beijing,Beijing 100083,China);Progress in Diffusion-rolling Bonding Mechanism of Metal Plate[J];Journal of Materials Engineering;2006-S1
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