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《Ordnance Material Science and Engineering》 2018-06
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Effect of adhesive on mechanical properties of PC board-foam FeNi-AA5052 sandwich structure

WEI Wenjie;HE Xiaocong;LIU Jiamu;DING Wenyou;Faculty of Mechanical and Electrical Engineering,Kunming University of Science and Technology;  
In order to study the effect of adhesive on the mechanical properties of PC board-foam FeNi-AA5052 sandwich structure,PC board-foam FeNi-AA5052 single-lap self-piercing riveting sandwich structure(group A)and the composite sandwich structure(group B),in which adhesive and self-piercing riveting are combined,were studied,and the static properties and failure modes of the sandwich structure were studied based on the static test.The results show that the nail head height of group B joint is 0.23 mm higher than that of group A,and the interlocking length of group B joint is increased by 0.14mm compared with that of group A.The residual bottom thickness of group B joint is increased by 0.01 mm compared with that of group A.Compared with group A,the static failure load of group B increases by 70.9%,the stiffness value increases by 8.6%,and the energy absorption value increases by 156.8%.During the static tensile test,the failure mode of group A is the tear of PC board in the joint area.The failure mode of group B is the breakage of PC board sheet.The adhesive improves the overall mechanical properties of the sandwich structure.
【Fund】: 国家自然科学基金(51565023)
【CateGory Index】: TB383.4;TG938
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