Full-Text Search:
Home|Journal Papers|About CNKI|User Service|FAQ|Contact Us|中文
《Semiconductor Optoelectronics》 2007-06
Add to Favorite Get Latest Update

Experiment Investigation on a Honeycomb Micro-channel Based Cooling System

CHENG Ting1,LUO Xiao-bing1,2,HUANG Su-yi1,LIU Sheng2,3(1.School of Energy and Power Engineering;2.Wuhan National Laboratory for optoelectronics;3.Institute of Micro-systems,Huazhong University of Science and Technology,Wuhan 430074,CHN)  
Heat dissipation by micro-channel heat sink provides a kind of new solution for thermal management.A kind of honeycomb micro-channel heat sink used for building a heat dissipation system is discussed.Experiments on such a system were conducted.The results demonstrate that with 13.3ml/s flow rate and room temperature of 32℃,the 17cm2 micro-channel heat sink can take out 233.63W heat,the corresponding heat flux of heat source is about 13.3W/cm2,in such a case,the temperature of the water inside the micro-channel heat sink is just about 52℃.It is also found that in order to take full advantage of micro-channel heat sink,without good heat exchange between system and environment for mini heat exchanger in present system,the micro-channel heat sink can not achieve good cooling effect.
【CateGory Index】: TK172
Download(CAJ format) Download(PDF format)
CAJViewer7.0 supports all the CNKI file formats; AdobeReader only supports the PDF format.
【Citations】
Chinese Journal Full-text Database 6 Hits
1 LIU Ting-ting~ 1, 2* ,GHO Yang~2,HAN Bin~1,HU Li~1 1. Information and Control Engineering College, Southwest University of Science and Technology, Mianyang, Sichuan, 621010,China; 2. Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang Sichuan 621900,China;Research on Fluid Flow and Heat Transfer of the V-Shaped Microchannel Heat Sink[J];Chinese Journal of Sensors and Actuators;2006-05
2 FU Gui-cui,GAO Ze-xi,FANG Zhi-qiang,ZOU Hang (Beijing University of Aeronautics and Astronautics, Dept. of System Engineering, Beijing 100083,China);A Study on Thermal Analysis of Electronic System[J];Electro-mechanical Engineering;2004-01
3 WANG Yan,DING Gui-fu, ZHANG Dong-mei, GU Dong-hua (National Key Laboratory of Nano/Micro Fabrication Technology, Key Laboratory of Thin Film and microfabrication of Ministry of Education, Institute of Micro and Nano Science and Technology, Shanghai Jiaotong University, Shanghai 200030, China);Design and Simulation of a Novel Microchannel Heatsink[J];Chinese Journal of Electron Devices;2007-01
4 LIU Qi-Ming XIA Guo-Dong LIU Qing MA Xiao-Yan MA Chong-Fang (College of Environment and Energy Engineering, Beijing University of Technology, The Key Laboratory of Ministry of Education, Beijing 100022, China);INVESTIGATION ON FLOW CHARACTERISTICS IN A MANIFOLD MICROCHANNEL (MMC)[J];Journal of Engineering Thermophysics;2007-01
5 YU Meng-Meng WU Hui-Ying QUAN Xiao-Jun CHENG Ping (School of Mechanical and Power Eng.,Shanghai Jiaotong Univ.,Shanghai 200030,China);INJECTION FLOW DURING THE CONVECTIVE CONDENSATION IN SILICON MICROCHANNELS[J];Journal of Engineering Thermophysics;2007-02
6 Liu Tingting 1,2 Gao Yang2 Yang Tao1 Li Leimin1 1.Southwest University of Science and Technology, Mianyang, 621010 2.Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang, 621900;Simulation Analysis for the Heat Transfer and Flow Issues in V-shaped Microchannel Heat Sink[J];China Mechanical Engineering;2005-14
【Co-citations】
Chinese Journal Full-text Database 8 Hits
1 Sang Guobiao,Yan Junwu(Beijing Institute of Astronautical Systems Engineering,Beijing,100076);Data Integration in Digitalization Development of Rocket Electrical System[J];Missiles and Space Vehicles;2005-05
2 LIU Xulei1, ZHOU Dejian1,2, HUANG Chunyue1, LI Yongli1 (1. School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, Guangxi Zhuangzu Zizhiqu, China; 2. Department of Mechanical Engineering, Guangxi University of Technology, Liuzhou 545006, Guangxi Zhuangzu Zizhiqu, China);Thermal analysis for a board-level circuit module based on orthogonal test[J];Electronic Components and Materials;2009-05
3 LI Qin,LIU Hai-dong,ZHU Min-bo(Xidian University,Xi′an 710071,China);Application of Thermal Simulation in the Structural Design of Electronic System[J];Electronics Process Technology;2006-03
4 WANG Yan-hai,ZHANG Shi-wei,XU Yan-feng(The 718th Research Institute of China Shipbuilding Industry Corporation,Handan 056027,China);Application of Icepak Simulation Software in Thermal Designing of Water Hydrocooling Board[J];Electro-Mechanical Engineering;2008-01
5 Sun Jian①② Ding Yao-gen① Chen Zhong-lin① ①(Institute of Electronics, Chinese Academy of Science, Beijing 100080, China) ②(Graduate University of Chinese Academy of Science, Beijing 100039, China);Research on the Thermal Analysis of PCB Circuit[J];Journal of Electronics & Information Technology;2009-04
6 BI Jin-dong,ZHANG San-di,ZHENG Li-xiang(CEPREI,Guangzhou 510610,China);Study on the TASPCB-based Thermal Analysis and Thermal Design of PCBs[J];Electronic Product Reliability and Environmental Testing;2009-04
7 AI Qing,XIA Xin-lin(School of Energy Science and Engineering,Harbin Institute of Technology,Harbin 150001,China);Numerical simulation of transient temperature field in the airborne radar cabin[J];Journal of Harbin Institute of Technology;2008-11
8 WANG Wei,MA Lian-xiang,KE Shun-kui,HE Yan;ADINA and its Application in Heat-analysis[J];Modern Machinery;2007-01
【Secondary Citations】
Chinese Journal Full-text Database 3 Hits
1 XIA Guo-Dong LIU Qing WANG Min MA Xiao-Yan LIU Qi-Ming MA Cheng-Fang (College of Environmental and Energy Engineering, Beijing University of Technology, Beijing 100022, China);THREE-DIMENSIONAL NUMERICAL OPTIMIZATION OF THE MANIFOLD MICROCHANNEL HEAT SINK[J];Journal of Engineering Thermophysics;2006-01
2 WANG Ji wen 1,2 , LIU Ru xun 1 (1 Department of Mathematics,University of Science and Technology of China, Hefei 230026, P R China; 2 Department of Computer Science and Engineering,Anhui University,Hefei 230039, P R China) [;FINITE VOLUME METHODS FOR SOLVING THE PROBLEM OF DISCONTINUOUS SOLUTION[J];Chinese Journal of Computation Physics;2001-02
3 WEN Jian guo,CAI De fang,WANG Shi yu, LI Han guo,FENG Qian,GUO Zhen (School of Technical Physics, Xidian Univ., Xi′an 710071, China);Study on the laser diodes heat charge and heat evolution technology in hi-power DPL system[J];JOUNAL OF XIDIAN UNIVERSITY;2000-04
©2006 Tsinghua Tongfang Knowledge Network Technology Co., Ltd.(Beijing)(TTKN) All rights reserved