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《Semiconductor Optoelectronics》 2009-06
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Analysis of Failure Mechanisms of White LEDs

YANG Shao-hua1,WU Fu-gen2,ZHANG Chun-hua2(1.National Key Laboratory for Reliability Physics of Electronic Product,5th Institute of MII,Guangzhou 510610,CHN;2.Experiment Center,Guangdong University of Technology,Guangzhou 510006,CHN)  
Discussed are the main failure modes and mechanisms of white LEDs during the processes of package and applications.Several cases for analyzing the failures are introduced.Finally,some reliability assurance measures are suggested to improve the lifetime and reliability of white LEDs,which are helpful for further improvement of the packaging technology.
【CateGory Index】: TN312.8
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1 ZHENG Dai-shun1, QIAN Ke-yuan1, LUO Yi(1,2) (1. Laboratory on Semiconductor Lighting,Graduate School at Shenzhen,Tsinghua University,Shenzhen 518055,CHN; 2. State Key Laboratory on Integrated Optoelectronics,College of Electr onic Engineering,Tsinghua University,Beijing 100084,CHN);Life Test and Failure Mechanism Analyses for High -power LED[J];Semiconductor Optoelectronics;2005-02
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