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《SEMICONDUCTOR TECHNOLOGY》 1999-06
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Popular Advanced Packaging Technologies

Wang Zheng (Department of Physics,University of Science & Technology,Hefei 230026) Liu Zhijing (Department of Astronomy and Applied Physics,University of Science & Technology,Hefei 230026)  
Advanced packaging technologies are taking place of traditional packaging processes.This article is concerned with the feature and application of advanced packaging technologies,which include chip scale package,multichip module,micro ball grid array,chip on board,chip on flex,flip chip on board and flip chip on flex.
【CateGory Index】: TN305.94
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【References】
Chinese Journal Full-text Database 1 Hits
1 WANG Zhen-yu, CHENG Li, GAO Ping, SHI Yi-qiao, ZHU Jun(Institute of Electricity & Information Engineering, Jiangsu University, Zhenjiang 212013,China);CSP technology and its development foreground[J];Semiconductor Technology;2003-12
【Co-references】
Chinese Journal Full-text Database 10 Hits
1 Tian Minbo,Liang Tongxiang,He Wei (Department of Materials Science and Engineering,Qinghua University,Beijing, 100084);Electronic Packaging Technologies and Materials[J];SEMICONDUCTOR INFORMATION;1995-04
2 Gao Shangtong(The 13th Institute,Ministry of EI,Shijiazhuang,050051);Investigation Summary for Microelectronics Packaging Technology in USA and Japan[J];SEMICONDUCTOR INFORMATION;1996-01
3 Gao Shangtong (The 13th Institute,Ministry of EI,Shijiazhuang,050051) Bi Keyun (The Electronic Academy of Science,Ministry of EI,Beijing,100846);Modern Electronic Packaging Technology[J];SEMICONDUCTOR INFORMATION;1998-02
4 Jia Songliang, Zhu Haoying, Luo Yanbin(Institute of Microelectronics, Tsinghua University, Beijing, 100084);Study and Application of Piezoresistive Stress Test Chip for IC Packages[J];CHINESE JOURNAL OF SEMICONDUCTORS;1998-11
5 Sun Yicai Fan Zhaoshu Chang Zhihong Shen Jinkai Gao Zhenbin Yang Ruixia(Hebei University of Technology,Tianjin 300130);The Chip Mounting Techniques for Pressure Sensors[J];;1998-02
6 QU Xin-fen,SU Wei (Electronic Engineering Institute, China Academy of Engineering Physics, Mianyang 621900, China);High-g Accelerometer in MEMS for Penetrator Weapon[J];Ordnace Industry Automation;2002-03
7 Fei Long;Zhong Xianxin;Wen Zhiyu;Gao Yang(The Open Laboratory Optoelectronic Technology and System of the State Education Commission, Chongqing University);Present Status and Developing Directions of Micromachined Silicon Acceleromter[J];JOURNAL OF TRANSDUCER TECHNOLOGY;1995-05
8 ;The Micro-assembling Materials for the Next Century[J];Materials Review;1997-01
9 ;Recent Progress in High Thermal Conductivity AIN Ceramies[J];Materials Review;1998-01
10 Huang Qiang Gu Mingyuan Jin Yanping(State Key Lab. of Metal Matrix Composite, Shanghai Jiaotong University .Shanghai 200030 China);Current Status of Research on Electronic Packaging Materials[J];Materials Review;2000-09
【Secondary References】
Chinese Journal Full-text Database 10 Hits
1 CHENG Li, WANG Zhen-yu, GAO Ping(Institute of Electricity & Information, Jiangsu University, Zhenjiang 212013, China);Latest progresses and developments of DRAM fabrication[J];Semiconductor Technology;2004-04
2 CHENG Li, WANG Zhen-yu, GAO Ping, ZHU Jun(Institute of Electricity & Information, Jiangsu University, Zhenjiang 212013, China);The technologies and applications of DFT for VLSI[J];Semiconductor Technology;2004-05
3 CHENG Li1, LI Chun-ming2,WANG Zhen-yu1, GAO Ping1(Institute of Electricity & Information, Jiangsu University, Zhenjiang 212013, China);The measures of new technology & development in IC industrial chain[J];Semiconductor Technology;2004-06
4 CHENG Li, WANG Zhen-yu, ZHU Jun, ZHAO Qian, SHI Shou-yong, ZHU Yi-yun (Institute of Electricity & Information, Jiangsu University, Zhenjiang 212013, China);Summary of WL-CSP technologies & their applications[J];Semiconductor Technology;2005-02
5 CHENG Li, ZHAO Qian, WANG Zhen-yu, ZHU Jun, FAN Mu-hong, LIU He-xiang (Institute of Electricity & Information, Jiangsu University, Zhenjiang 212013, China);Technology & Applications of Scattering with Angular Limitation in Projection Electron-Beam Lithography[J];Semiconductor Technology;2005-06
6 CHENG Li, WANG Zhen-yu, ZHU Yi-yun, LIU He-xiang(Institute of Electricity & Information, Jiangsu University, Zhenjiang 212013, China);Extremely Ultraviolet Lithography Fabrication Technology for Nanometer ULSI Devices[J];Semiconductor Technology;2005-09
7 LU Jin,CHENG Li,WANG Zhen-yu,LI Lan,LI Jia-yuan,WANG Jian-min (Institute of Electricity and Information, Jiangsu University, Zhenjiang 212013, China);Advanced Stacked 3D Packaging Technology and Its Application Prospects[J];Semiconductor Technology;2006-09
8 YAN Xue-ping, CHENG Li, HAN Qing-fu, ZHANG Hui, LI Jun, LIU De-lin, XU Zhi-chun (Institute of Electricity and Information, Jiangsu University, Zhenjiang 212013, China);Package Materials and Processes of MEMS Devices[J];Semiconductor Technology;2006-12
9 HAN Qing-fu,CHENG Li,YAN Xue-ping,ZHANG Hui,LIU De-lin,LI Jun,XU Zhi-chun(Institute of Electricity and Information,Jiangsu University,Zhenjiang 212013,China);Technology of System in Package and Its Applications Prospects[J];Semiconductor Technology;2007-05
10 CHENG Li,YANG Jian-ning,WANG Zhen-yu,LI Jia-yuan,LI Hua-le,HE Xing(Institute of Electricity and Information,Jiangsu University,Zhenjiang 212013,China);Ball Grid Array Package and Its Reprocess Technology[J];Semiconductor Technology;2007-06
China Proceedings of conference Full-text Database 1 Hits
1 Ren Hui Yang Bangchao Su Hong Gu Yonglian Jiang Ming (University of Electronic Science and Technology of China, Chengdu 610054);The Invalidity Analysis and Thermal Stress/Strain Simulation of BGA Solder Ball[A];[C];2005
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