Silicon wafer cleaning
CHU Jia, MA Xiang-yang, YANG De-ren, QUE Duan-lin (State Key Lab. of Silicon Material Science, Zhejiang University, Hangzhou 310027, China)
This paper is a review on the evolution of cleaning technologies and theories, focusing on the recipes of cleaning solutions, their characteristics, mechanism and their impacts on the surface quality of polished wafers. The effects of improved RCA1 are presented in particular, RMS and metal contamination, and the correlation with the cleaning sequence. Extremely diluted RCA2 can reduce metal contamination down to 1010at/cm2, and is unlikely to introduce particle re-deposition. At last, the up-to-date technologies of wafer cleaning are discussed.