Full-Text Search:
Home|Journal Papers|About CNKI|User Service|FAQ|Contact Us|中文
《Semiconductor Technology》 2001-03
Add to Favorite Get Latest Update

Silicon wafer cleaning

CHU Jia, MA Xiang-yang, YANG De-ren, QUE Duan-lin (State Key Lab. of Silicon Material Science, Zhejiang University, Hangzhou 310027, China)  
This paper is a review on the evolution of cleaning technologies and theories, focusing on the recipes of cleaning solutions, their characteristics, mechanism and their impacts on the surface quality of polished wafers. The effects of improved RCA1 are presented in particular, RMS and metal contamination, and the correlation with the cleaning sequence. Extremely diluted RCA2 can reduce metal contamination down to 1010at/cm2, and is unlikely to introduce particle re-deposition. At last, the up-to-date technologies of wafer cleaning are discussed.
【Fund】: 国家自然科学基金!(69976025) ;;教育部博士点基金和优秀青年教师基金资助
【CateGory Index】: TN305
Download(CAJ format) Download(PDF format)
CAJViewer7.0 supports all the CNKI file formats; AdobeReader only supports the PDF format.
©2006 Tsinghua Tongfang Knowledge Network Technology Co., Ltd.(Beijing)(TTKN) All rights reserved