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《Semiconductor Technology》 2003-03
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Copper/low k dual damascene processLI

Ding-dong , PU Sheng(Applied Materials China , Shanghai, 201203 China)  
Dual damascene technology of Cu / low dielectric layer is introduced in this paper, andthis technology has been used in manufacturing DRAM and logic devices.
【CateGory Index】: TN305
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【References】
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