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《Semiconductor Technology》 2004-05
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Thermal design of power component and optimal design of heat sink

FU Gui-cui,GAO Ze-xi,ZOU Hang,WANG Dan-yan(Dept. of Systems Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100083, China)  
Power components are key components in most electronic devices and theirfunctional modes affect directly the reliability of the whole machine. The thermal design of powercomponent and the optimization of heat sink from the application is introduced. A software is devel-oped and confirmed by experimental results.
【CateGory Index】: TN402
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