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《Semiconductor Technology》 2006-09
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Advanced Stacked 3D Packaging Technology and Its Application Prospects

LU Jin,CHENG Li,WANG Zhen-yu,LI Lan,LI Jia-yuan,WANG Jian-min (Institute of Electricity and Information, Jiangsu University, Zhenjiang 212013, China)  
A chip could include more transistors and could be smaller, higher performance, lower power consumption with stacked 3D packaging technology. The stacked 3D package can defi- nitely outperform other types of package. The development, characteristics, advantages, heat emis- sion and applications of the stacked 3D packaging technology were introduced.
【Fund】: 江苏大学高级人才启动项目(1283000149);; 江苏省高校自然科学研究基金项目(04KJB310171)
【CateGory Index】: TN305.94
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