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《Semiconductor Technology》 2006-10
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The Improvement of Wafer Surface Condition and Polishing Slurry in the Process of Wafer Polishing

ZHANG Wei,ZHOU Jian-wei,LIU Yu-ling,LIU Cheng-lin (Institute of Microelectronics,Hebei University of Technology,Tianjin 300130,China)  
In the process of wafer polishing, the wafer surface could be damaged badly and fragment rate will increase sharply, because of the accumulation of stress and the mechanical action. A kind of polishing slurry is introduced to change the fierce mechanical action into the tender chemi- cal-mechanical action, and some positive effect can also be made by it. The wafer surface condition is improved to some extent, and the production efficiency is increased.
【CateGory Index】: TN305
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