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《Semiconductor Technology》 2007-08
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Microchannel Plate Double-Sided Polishing Technology

YAN Cheng1,JIN Ge1,WANG Yi-jun2,ZHANG Zheng-jun1,SUN Jian-ning1,SU De-tan1 (1.North Night Vision Technology Co.,Ltd,Beijing 100089,China;2.Department of Physics,Xianyang Normal College,Xianyang 712000,China)  
According to the characteristics of core,clad and solid rim glass material of microchannel plate(MCP),the mechanism of double-sided polishing of MCP was analyzed.The influence of the technological parameters(polishing powder, polishing pressure,polishing liquid pH value,etc)on the surface roughness and surface quality was studied.The double-sided polishing technology and technological parameters were provided.CeO2 was chosen as polishing powder with 6 Vickers hardness and 1.5 μm particle size.The polishing pressure and time were appointed by the given step by step technology;The pH value of polishing liquid has obvious influence on roughness of MCP,heightens with the polishing time during the polishing course.The pH value should be controlled 6~8.
【Fund】: 国家部委重点基金资助项目(4040505101B)
【CateGory Index】: TN152
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【References】
Chinese Journal Full-text Database 1 Hits
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