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《Semiconductor Technology》 2008-11
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Method for Eliminating the Influence of Temperature on the Alignment Precision in Flip-Chip Bonding

Zhang Lina,Han Lei(Key Laboratory of Modern Complex Equipment Design and Extreme Manufacturing,Ministry of Education,Central South University,Changsha 410083,China)  
To eliminate the influence of temperature on the alignment precision of chips and substrates in the process of thermosonic flip-chip bonding,the image dithering caused by heating must be controlled in sub-pixel scope.A set of experiments was designed by contrasting two sets of experiments.It was found that the image dithering intensely and significantly affected by temperature when without the pneumatic device,so can not meet the requirement of precision alignment.The sub-pixel method based on binary quadratic curved surface fitting was adapted to computing the translation between images after using the pneumatic device.Found the integral pixel image dithering was disappeared and the influence of temperature on sub-pixel image dithering became small.The largest dithering at the working temperature is less than 0.3 pixel,which can meet the requirement of precision alignment.This method proposed a valuable reference for the technology of thermosonic flip-chip bonding.
【Fund】: 国家自然科学基金(50575230 50675227);; 国家重点基础研究发展计划(973)项目(2003CB716202);; 湖南省自然科学基金面上项目(07JJ3091)
【CateGory Index】: TP391.41
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