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《Semiconductor Technology》 2008-11
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Study on the Reliability Increasing of Glass Diode

Han Wenjue1,2,Wang Haifeng1,2,Luo Chunlian1,2,Tian Haibing1,2 (1.College of Materials Science and Engineering,Donghua University,Shanghai 200051,China;2.Engineering Research Center of Advanced Glass Manufacturing Technology,Ministry of Education,Shanghai 200051,China)  
Phrase changing of ZrO2 in ZnO-B2O3-SiO2 system glass-ceramics was used to increase the flexibility of the glass diode and improve the reliability as well.In the experiment superfine ZrO2 was mixed evenly with ZnO-B2O3-SiO2 system glass-ceramics powder and sintered at high temperature to get the new glassceramics.The flexibility of the glass-ceramics was studied by AKASHI pressing mark method.The typical phase of ZrO2 in glass diode was studied with XRD.The results show typical phases of t-ZrO2 and m-ZrO2 are available in diode glass-ceramics after packaging process.And the flexibility of glass-ceramics is improved by adding superfine zirconia in the glass-ceramics.Also the result of the diode packaging process experiments,physical and chemical properties tests show that the reliability and thermal shock resistance of diode are improved when certain superfine zirconia adds into the glass diode.
【Fund】: 上海市重点学科建设项目资助(B603)
【CateGory Index】: TN31
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