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Recent Progress of ACF in Flat Panel Display Packaging Applications

Zhang Yingyi,Fu Yuepeng,Tan Kai,Tian Minbo(Department of Materials Science and Engineering,Tsinghua University,Beijing 100084,China)  
With the development trends toward to large-scale,low-profile,high-resolution of flat panel display,it needs high requirement for flat panel display packaging technology.Anisotropic conductive films(ACF)are realized to meet the requirement of fine pitch capability and are widely used in FPDs(flat panel displays)packaging technologies so far.Various packaging technologies such as TCP(tape carrier package),COF(chip on flex)and COG(chip on glass)using ACFs are summarized.Different requirements for ACFs used in the packaging technologies are analyzed,and the recent advances in structure and performance improvement of ACFs are pointed out,such as the size,hardness,content ratio of conductive particles and the type of resin used in ACF.
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