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《Semiconductor Technology》 2010-12
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Experimental Study of Al-Mg Alloy Chemical Mechanical Polishing in Alkaline Condition

Xu Wenzhong,Liu Yuling,Niu Xinhuan,Mu Huilai(Institute of Microelectronics,Hebei University of Technology,Tianjin 300130,China)  
CMP technology was extended to the surface processing of Al-Mg alloy.According to the features of polishing cloth and the nature of Al-Mg alloy,the polishing cloth was selected.And then the corresponding polishing solution was producted with the study of Al-Mg alloy chemical mechanical polishing in alkaline condition.Finally,three key polishing parameters of the pH,polishing pressure and slurry flow rate were optimized.The results of experiments indicate that the surface can be in a good condition when the pH value is 11.20,polishing pressure is 0.05 MPa,and the slurry flow rate is 220 ml/min.Through measureing the surface roughness with NewView 6 000,the result shows that it has reached the nanometer level.
【Fund】: 国家自然科学基金资助项目(10676008);; 河北省教育厅科学研究计划项目(2007429)
【CateGory Index】: TN305.2
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【Citations】
Chinese Journal Full-text Database 1 Hits
1 HE Han Wei a * , HU Yue Hua b , ZHOU Ke Chao a , XU Jin b ( aState Key Laboratory of Powder Metallutgy,Central South University,Changsha 410083; bSchool of Resources Processing and Bioengineering,Central South University,Changsha );Recent Advancement of Chemical-Mechanical Polishing Technology of Metal[J];Chinese Journal of Applied Chemistry;2003-05
【Co-citations】
Chinese Journal Full-text Database 3 Hits
1 Bian Zheng,Wang Shengli,Liu Yuling,Xiao Wenming(Institute of Microelectronics,Hebei University of Technology,Tianjin 300130,China);Study on the Influence and Optimization of Process Parameters of Tungsten Molybdenum Alloys in CMP[J];Semiconductor Technology;2010-02
2 Shu Xingjun~1 He Jianguo~1 Tao Jizhong~1 Dai Xiaojing~1 Liu Yuling~2(1.Institute of Mechanical Manufacturing Technology,CAEP,Mianyang Sichuan 621900,China;2.Institute of Microelectronic Technology & Materials,Hebei University of Technology,Tianjin 300130,China);The Experiments Research of Ta-W Alloy Chemical Mechanical Polishing[J];Lubrication Engineering;2006-03
3 ZHANG Xin-yun,WAN Hong-qiang,LU Ying(School of Mechatronic Engineering,Xi'an Technological University,Xi'an 710032,China);A Vibrating Device of Strengthening and Polishing and Its Experimentation[J];Journal of Xi'an Technological University;2006-04
【Secondary Citations】
Chinese Journal Full-text Database 2 Hits
1 HE Han-wei1, HU Yue-hua2, HUANG Ke-long1 (1. College of Chemistry & Chemical Engineering, Central South University, Changsha, Hunan 410083, China;2. Department of Mineral Engineering,Central South University, Changsha, Hunan 410083, China);Electrochemical Behavior of Copper in HNO_3 Aqueous Solution Containing BTA during CMP[J];The Chinese Journal of Process Engineering;2002-01
2 HE Han Wei , HU Yue Hua , HUANG Ke Long ( aCollege of Chemistry and Chemical Engineering; bDepartment of Mineral Engineering,Central South University,Changsha 410083);Electrochemical Behavior of Copper in Methylamine Aqueous Solution Containing K_3Fe(CN)_6 during CMP[J];Chinese Journal of Applied Chemistry;2001-11
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