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Study and application of electroless plating process in micro-electronic materials

HE Ying 1 ,SANG Wen-bin 2 ,WANG Jun-an 3(1.Department of Polymer Materials;2.Department of Electronic Information Materials;3.Institute of Materials,School of Materials Science and Engineering,Shanghai University,Shanghai200072,China)  
The applications of the process of electroless plating in micro-electronic materials are briefly reviewed in this paper.Also,the effects of several main electroless platings of nickel,copper,tin,cobalt and noble metals are discussed.Properties of the electroless plating in micro-electronic materials as well as the research and development tendency are then clarified.
【Fund】: 上海市纳米科技专项基金资助课题(No.0252nm012)
【CateGory Index】: TQ153
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