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《Micronanoelectronic Technology》 2005-07
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Reducing the Contents of Metal Ions in Nanometer SiO_2 Colloid for CMP and the Study Mechanism

ZHANG Jian-xin,LIU Yu-ling,WANG Juan,ZHANG Yuan(Institute of Microelectronics,Hebei University of Technology,Tianjin 300130,China)  
The effects of cation and anion resin on ellimination mechanism of metal ions exchange in SiO2 colloid are studied.A three-step method is used to elliminate the metal ions in the SiO2 colloid.The organic alkali is added to adjust the pH to the alkali stablevalue,in this case,the high pure and stable SiO2 colloid solution for the micro-electronic CMP is obtained.
【Fund】: 天津市自然科学基金科技发展计划项目(043801211)
【CateGory Index】: TN405
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【References】
Chinese Journal Full-text Database 1 Hits
1 ZHANG Jian-xin1,LIU Yu-ling1,ZHANG Kai-liang2,TAN Bai-mei1,NIU Xin-huan1,WANG Juan1(1.Institute of Microelectronics,Hebei University of Technology,Tianjin 300130,China;2.School of Electronics Information and Communications Engineering,Tianjin University of Technology,Tianjin 300191,China);Growth and Control Mechanism of Silica Sol Nano-Abrasive with Large-Particle for CMP Slurry[J];Nanotechnology and Precision Engineering;2008-02
【Citations】
Chinese Journal Full-text Database 2 Hits
1 Liu Yuling,Liu Na(Hebei University of Technology,Tianjin 300130);The Analysis and Research About Silicon Wafer′s Polishing Fog[J];SEMICONDUCTOR TECHNOLOGY;1998-01
2 ZHU Chunxi et al.(Shanghai Jiaotong Uni.,Shanghai 200030);THE PROGRESS TO RECOGNIZE THE HARDENING MECHANISM OF WATERGLASS.[J];Inorganic Chemicals Industry;2001-01
【Co-citations】
Chinese Journal Full-text Database 10 Hits
1 Peng Shaofang,Zhang Zhao (College of Chemical Engincering,Sichuan university,Chengdu,610065);General considerations on Preparation of Metal Nanopowder by Chemical Reduction Method[J];Sichuan Nonferrous Metals;2003-02
2 SHEN Rong,GAO Hong-Wen,ZHENG Li-Xin (School of Chemistry and Chemical Engineering, Anhui University,Hefei 230039,China);Study of langmuir aggregation of resorcin blue on Cetyl Trimethylammonium Bromide[J];Journal of Anhui University(Natural Sciences);2002-04
3 YANG Feng-xia1,LIU Qi-li2,BI Lei1(Department of Chemical Engineering,Henan Institute of Science and Technology,Xingxiang Henan 453003,China);Research on the Application of Nano-Zinc Oxide[J];Anhui Chemical Industry;2006-01
4 DI Wei-guo1, LIU Yu-ling1, SI Tian-hua2(1.Hebei University of Technology, Tianjin 300130,China;2.Luoyang Single Crystal Silicon Factory,Luoyang 471009,China);Chemomechanical polishing technique of silicon substrate in ULSI[J];Semiconductor Technology;2002-07
5 SU Jian-xiu, KANG Ren-ke, GUO Dong-ming(School of Mechanical Engineering, University of Dalian Technology, Dalian 116024,China);Technology analysis of wafer chemical mechanical polishing in the manufacture of ULSI[J];Semiconductor Technology;2003-10
6 LUO Yu-qing,KANG Ren-ke,GUO Dong-ming,JIN Zhu-ji(School of Mechanical Engineering,University of Dalian Technology,Dalian 116024,China);Application and research of endpoint-detection technology for chemical mechanical polishing of large size wafer[J];Semiconductor Technology;2004-06
7 CHEN Su,ZHANG Kai-liang,SONG Zhi-tang,FENG Song-lin (Research Center of Functional Semiconductor Film Engineering Technology, Shanghai Institute of Microsystem and Information Technology, CAS, Shanghai 200050, China);Advances in Chemical Mechanical Polishing of Copper in Mutilevel Interconnect[J];Semiconductor Technology;2005-08
8 CHEN Zhi-gang, CHEN Yang, CHEN Ai-lian ( School of Material and Engineering; School of Mechanical Engineering, Jiangsu Polytechnic University, Changzhou 213016,China);Chemical Effect Mechanism in Chemical Mechanical Polishing for Silicon Wafer[J];Semiconductor Technology;2006-02
9 YAN Zhi-rui,LU Jin-jun,LI Yao-dong,WANG Ji,LIN Lin (GRINM Semiconductor Materials Co.Ltd,Beijing 100088, China);Technology Analysis of 300mm Wafer CMP[J];Semiconductor Technology;2006-08
10 LIU Chang-yu,LIU Yu-ling,WANG Juan,NIU Xin-huan (Institute of Microelectronics, Hebei University of Technology, Tianjin 300130, China);Study of Computer Hard Disk Substrate and Its CMP[J];Semiconductor Technology;2006-08
China Proceedings of conference Full-text Database 7 Hits
1 LIU Yu-ling TAN Baimei LI Wei-wei (Institute of Microelectronics,Hebei University of Technology,Tianjin,300130,China);A Study of CMP nanometer abrasive Preparation technology[A];[C];2004
2 TAN Baimei LIU Yuling ZHAO Zhiwen HAO Ziyu ZHOU Jianwei WANG Shengli (School of Information Technology,Hebei University of Technology,Tianjin,300130,China);Application of Surfactant in Semiconductor Silicon Crystal Processing[A];[C];2004
3 LI Dian-chu, WANG Juan-li, MA Jian-jie , CHEN Gang-qing , LI Rui-feng , WANG Zhi-zhong ( College of Chemistry and Chemical Engineering, Taiyuan University of Technology, Taiyuan 030024, China; The Light Industry Branch of Shanxi General Vocational Technical College, Taiyuan 030013, China);DISPERSION OF NANO-SIZED ZnO IN GLAZE[A];[C];2006
4 Tan Gang Wu Jiali (Center of Advanced Sensor and Actuator, Chinese Academy of Engineering Physics, Mianyang 621900, China);Chemic-mechanical Polishing of Silicon Wafer[A];[C];2005
5 HE Fei, HE Xiao-dong, LI Yao, HAN Jie-cai (Center for Composite Materials, Harbin Institute of Technology, Harbin 150001, China);Factors affecting porous structure of silica xerogels[A];[C];2005
6 DONG Jue CHEN Qi-yuan YIN Zhou-lan (School of Chemistry and Chemical Engineering,Central South University,Changsha 410083,China);Influence of polyethylene glycol on superfine aluminum hydroxide prepared by ion-exchange membrane electrolysis method[A];[C];2008
7 ZHANG Qi-mei~1 WANG Jia-jun~2 (1.Zhejiang Sci-tech University,Hangzhou 310018,China; 2.Key Lab.of Advanced Textile Materials and Preparation Technology,Hangzhou 310018,China);Vacuum Plating Titanium Dioxide on Polyethylene Packaging Film[A];[C];2007
【Co-references】
Chinese Journal Full-text Database 10 Hits
1 Niu Mutong, Wu Weiduan, Guo Shengping (College of Material Science and Engineering, Huaqiao University, Quanzhou 362011, China);STUDY ON PROPERTIES OF EPOXY RESIN/SHORT CARBON FIBER/SERICITE COMPOSITE[J];Engineering Plastics Application;2006-01
2 LI Yong,WANG Yu-lian,QIN Yan-fu,LI Qian,GUANG Bang-gui,LV Yue-feng(College of Sciences,Anhui Science and Technology University,Fengyang 233100,China);Study on Method of Removing Iron from Silica Sand[J];Journal of Anhui Science and Technology University;2008-02
3 SU Jian-xiu, KANG Ren-ke, GUO Dong-ming(School of Mechanical Engineering, University of Dalian Technology, Dalian 116024,China);Technology analysis of wafer chemical mechanical polishing in the manufacture of ULSI[J];Semiconductor Technology;2003-10
4 Liu Hongmei;Yi Baolian(College of Chemical Engineering of BUU,Beijing,100023)(Dalian Institute of Chemical Physics,Academia Sinica,Dalian,116012);The Effect of Operation Conditions on the Particle Size in the Process Producing Silica Sols by Electrodialysis[J];JOURNAL OF BEIJING UNION UNIVERSITY;1996-04
5 LIU Qing-hua,LI Ya-dong(Academy of Material Engin,Suzhou University,Suzhou 215021,China);Study of thermal properties of epoxy composite filled with ultra-fine AlN[J];Journal of Transducer Technology;2005-11
6 Huang Qiang Gu Mingyuan Jin Yanping(State Key Lab. of Metal Matrix Composite, Shanghai Jiaotong University .Shanghai 200030 China);Current Status of Research on Electronic Packaging Materials[J];Materials Review;2000-09
7 HA En-hua, KOU Kai-chang, YAN Lu-ke,YAN Hai-yan(Department of Chemical Engineering,Northwestern Polytechnical University,Xi′an 710072,China);Study on Properties of Epoxy/Nano-silica Encapsulating Materials Obtained from In situ Polymerization[J];Journal of Materials Engineering;2005-08
8 YAN Shi-kai~(1,2),HU Peng~(1,2),YUAN Fang-li~1,LI Jin-lin~1 (1 Institute of Process Engineering,Chinese Academy of Sciences,Beijing 100080,China;2 Graduate School of Chinese Academy of Sciences,Beijing 100039,China);Spheroidization of Silica Powders in a Radio Frequency Plasma[J];Journal of Materials Engineering;2006-02
9 HOU Gui-hua,LUO Ju-hua,CHEN Jin-wen(Center of Physical Testing and Chemical Analysis,Yancheng Institute of Technology,Yancheng 224003,China);Synthesis of Ordered Mesoporous Silica from Rice Husk Ash[J];Journal of Materials Science and Engineering;2006-04
10 Xie Guang-chao (Henkel-Huawei Electronics Co., Ltd., Jiangsu Lianyungang 222004, China );Research on Filler Used for Package Resin[J];Electronics & Packaging;2006-05
【Secondary References】
Chinese Journal Full-text Database 5 Hits
1 Lu Zhong,Chen Yang(Department of Material and Engineering,Jiangsu Polytechnic University,Changzhou 213164,China);Research and Development of Chemical Mechanical Polishing Slurry[J];Semiconductor Technology;2009-12
2 LI Jun,JIANG Shu-xing,(Key Laboratory of New Processing Technology for Nonferrous Metals and Materials,Ministry of Education, Guilin University of Technology,Guilin 541004,China.);Current Status of Preparation Methods of Spherical Silica Micro-Powder[J];Foshan Ceramics;2012-11
3 FAN Yuan-qing,CHEN Lian-xi,BAI Xiang-ge(Wuhan University of Technology,Wuhan 430070,China);Preparation and Application of Large Particle Size High Concentration Silica Sol[J];Liaoning Chemical Industry;2010-03
4 ZHANG Jian,SHI Bao-jun,DU Yun-dong,et al.(School of Mechanical and Electric Engineering,Shandong Jianzhu University,Jinan 250101,China);Advances and problems of chemical mechanical polishing[J];Journal of Shandong Jianzhu University;2009-02
5 LI Jun,JIANG Shu-xing,(Key Lab of New Processing Technology for Nonferrous Metals and Materials,Ministry of Education,Guilin University of Technology, Guilin 541004,Guangxi);Current Status of Preparation of Spherical Silica Powder[J];Silicone Material;2012-06
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