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《Micronanoelectronic Technology》 2006-01
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Research of Sapphire Substrate CMP

ZHAO Zhi-wen,NIU Xin-huan,TAN Bai-mei,YUAN Yu-jie,LIU Yu-ling (Institute of Microelectronics Technology and Materials,Hebei University of Technology,Tianjin 300130,China)  
Chemical mechanical polishing(CMP)technique of sapphire substrate was introduced,and the foreground application of sapphire substrate,the problems existed in the CMP technique were summarized,and the factors that influence the CMP process were summarized. The capability parameters and the influence factors of the sapphire CMP technique were systematically analyzed. Feasible projects of using abrasive of large particle size and low dispersity,appending the organic alkali and surfactant were suggested. It could advance the surface performance and machining efficiency of sapphire substance effectively.
【CateGory Index】： TN304.05
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