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《SEMICONDUCTOR INFORMATION》 1995-04
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Electronic Packaging Technologies and Materials

Tian Minbo,Liang Tongxiang,He Wei (Department of Materials Science and Engineering,Qinghua University,Beijing, 100084)  
The types of electronic packaging are introduced and the current state and tendency of packaging technologies an materials are reviewed in this paper.The emphasis,is placed on the metallization of high thermal conductivity AIN ceramics substrates and AIN-W co-fired multilayer substrates.
【CateGory Index】: TN305.94
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