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《Chinese Journal of Semiconductors》 2002-08
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Evolution Residual In-Plane Stress During Curing Process and Thermal Treatment of COB Packages

Sun Zhiguo,Zhang Qun,Huang Weidong,Jiang Yuqi,Cheng Zhaonian and Luo Le(Shanghai Institute of Microsystem and Information Technology,The Chinese Academy of Sciences,Shanghai 200051,China)  
A silicon piezoresistive sensor is applied here to in-situ record the curing stress profile,the distributions of the residual stress and the stress evolution profile during thermal treatment. It is also found that the residual stress will accumulate dramatically in the thermal treatment after 20 days' storage in air after the curing process,while the residual stress will be stabilized in a relatively low level after thermal treatment next to the curing process.
【Fund】: 国家重点基础研究资助项目 ( No.G19990 3310 8)~~
【CateGory Index】: TN305.94
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【References】
Chinese Journal Full-text Database 3 Hits
1 Huang Weidong,Sun Zhiguo,Cai Xia,Luo Le and Cheng Zhaonian(Shanghai Institute of Microsystem and Information Technology,The Chinese Academy of Sciences,Shanghai 200050,China);Distribution of Residual Stress in Packaging Assemblies of Chip on Board[J];Chinese Journal of Semiconductors;2003-06
2 Song Jing,Huang Qing’an, and Tang Jieying(Key Laboratory of MEMS of Ministry of Education,Southeast University,Nanjing 210096,China);Effects of Die Bonding on MEMS Characteristics:Cell Library[J];Chinese Journal of Semiconductors;2006-01
3 LI Ming, HUANG Qing-an, SONG Jing,CHEN Fan-xiu,TANG Jie-ying,Yu Cun-jiang (Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing 210096, China);Study of the Thermomechanical Coupling Effect in COB Packaging Structures[J];Chinese Journal of Sensors and Actuators;2006-05
【Citations】
Chinese Journal Full-text Database 1 Hits
1 Jia Songliang, Zhu Haoying, Luo Yanbin(Institute of Microelectronics, Tsinghua University, Beijing, 100084);Study and Application of Piezoresistive Stress Test Chip for IC Packages[J];CHINESE JOURNAL OF SEMICONDUCTORS;1998-11
【Co-references】
Chinese Journal Full-text Database 10 Hits
1 Song Jing,Huang Qing’an, and Tang Jieying(Key Laboratory of MEMS of Ministry of Education,Southeast University,Nanjing 210096,China);Effects of Die Bonding on MEMS Characteristics:Cell Library[J];Chinese Journal of Semiconductors;2006-01
2 LI Zhihua, XIE Keyu(College of Material Science and Engineering, Central South University, Changsha 410083);Progress in Study on Crack Initiation in Epoxy Resin Sealing Compounds at Low Temperature and its Measures[J];Materials Review;2006-08
3 HA En-hua, KOU Kai-chang, YAN Lu-ke,YAN Hai-yan(Department of Chemical Engineering,Northwestern Polytechnical University,Xi′an 710072,China);Study on Properties of Epoxy/Nano-silica Encapsulating Materials Obtained from In situ Polymerization[J];Journal of Materials Engineering;2005-08
4 SONG Qian (Sichuan Jiuzhou Electronic Technology Co.,LTD,Mianyang 621000,China);Application and Tend of Epoxy of Sealing in Electronic Products[J];Electronics Process Technology;2001-02
5 WANG Yu-fei,SU Gui-ming,LIU Gang,JIANG Wei-Li,ZHOU Chun-yan(Harbin Chemical Industry Research Institute,Harbin 150020,China);Study on New Anti-crack Electric Transmission Device Pouring Sealant[J];Electronics Process Technology;2006-04
6 YANG Xiao-wang,LU Shao-rong,YU Jin-hong,WU Bing(Key Laboratory of Nonferrous Metal Materials and New Processing Technologyof Ministry of Education,Guilin 541004,China);Synthesis and Application of Novel Liquid Crystalline Epoxy Resin Containing Ester[J];Polymer Materials Science & Engineering;2008-02
7 SONG Yuan-jun,HUANG Yu-dong,SUN De-zhi(Harbin Institute of Technology,Harbin 150001,China);Effect of mixing proportion on performance of sealant used for lead-acid storage battery[J];China Adhesives;2008-10
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9 WANG Huaiwen KANG Yilan XIE Heping Department of Mechanics,Tianjin University,Tianjin 300072,China Institute of Rock Mechanics and Fractals,China University of Mining and Technology,Beijing 100083,China Sichuan University,Chengdu 610065,China;ADVANCE IN DIGITAL SPECKLE CORRELATION METHOD AND ITS APPLICATION[J];Advances In Mechanics;2005-02
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【Secondary References】
Chinese Journal Full-text Database 8 Hits
1 Peng Yaowei 1,Chan Justy 2,Wang Zhiping 2,and Xiao Fei 1(1 Department of Material Science,Fudan University,Shanghai 200433,China)(2 China Technology Center,Philips Mobile Display Systems,Shanghai 200131,China);Damage of Bonding Force on IC Aluminum Pad in COF Structure[J];Chinese Journal of Semiconductors;2005-01
2 Nie Meng,Huang Qing’an,and Li Weihua(Key Laboratory of MEMS of Ministry of Education,Southeast University,Nanjing 210096,China);An In-Situ Extracting Method for Residual Stresses of a Multilayer Film by Full-Field Optical Measurement[J];Chinese Journal of Semiconductors;2005-05
3 Li Ming,Song Jing,Huang Qing’an,and Tang Jieying(Key Laboratory of MEMS of the Ministry of Education,Southeast University,Nanjing 210096,China);Thermally Induced Packaging Effect on the Resonant Frequencies of a Fixed-Fixed Beam[J];Journal of Semiconductors;2008-01
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