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《Chinese Journal of Semiconductors》 2003-06
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Distribution of Residual Stress in Packaging Assemblies of Chip on Board

Huang Weidong,Sun Zhiguo,Cai Xia,Luo Le and Cheng Zhaonian(Shanghai Institute of Microsystem and Information Technology,The Chinese Academy of Sciences,Shanghai 200050,China)  
The distribution of residual stress in the packaging assemblies of chip on board (COB) is investigated using FE simulations and experiments.Using FR4 and ceramic substrates,the most obvious difference of residual stress is on the distribution of equivalent stress.The simulation results show that the thickness of the substrate has an influence on residual stress only for thickness 0~1.0mm.The simulations also indicate that the thickness of adhesive has some effects only on the residual shear stress when FR4 substrate is used.But in case of ceramic substrate,the equivalent stress decreased significantly as the thickness of adhesive increased.It means that the adjustment of the thickness of adhesive could be served as a process for low stress packaging of a ceramic-based structure.The simulated results are near to the data measured by test of silicon piezoresistive sensors,and the signs (positive or negative) of the residual stress of both the simulation and measurement are also the same everywhere on the top surface of the die.
【CateGory Index】: TN305.94
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