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A Novel Analytical Thermal Model for Temperature Estimation of Multilevel ULSI Interconnects

Wang Nailong and Zhou Runde(Institute of Microelectronics,Tsinghua University,Beijing 100084,China)  
A novel analytical thermal model for estimating the temperature rise of multilevel ULSI interconnects is presented,and the impact of joule heating,via effect,and heat fringing effect is investigated in details.After considering the via effect and heat fringing effect of multilevel ULSI interconnects,LTem provides more accurate temperature estimation of the multilevel interconnects.
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