Full-Text Search:
Home|Journal Papers|About CNKI|User Service|FAQ|Contact Us|中文
《Chinese Journal of Semiconductors》 2005-05
Add to Favorite Get Latest Update

An In-Situ Extracting Method for Residual Stresses of a Multilayer Film by Full-Field Optical Measurement

Nie Meng,Huang Qing’an,and Li Weihua(Key Laboratory of MEMS of Ministry of Education,Southeast University,Nanjing 210096,China)  
A novel in-situ extracting method for residual s tresses of a multilayer film based on back etching is proposed,in which only back films of the substrate need to be etched in turn and corresponding curvature radii needs to be measured.Then residual stress of each film layer can be obtained.It is verified by simulation and experiment that the novel method is a simple and accurate in-situ extracting method for residual stresses of the multilayer film with no destruction to front films.
【Fund】: 国防预研项目资助(批准号:41308050206)~~
【CateGory Index】: TN407
Download(CAJ format) Download(PDF format)
CAJViewer7.0 supports all the CNKI file formats; AdobeReader only supports the PDF format.
【References】
Chinese Journal Full-text Database 2 Hits
1 Wang Shasha1,Chen Jing 1,,Li Dachao2,Huang Yubo2,and Li Zhihong1(1 National Key Laboratory of Micro/Nano Fabrication Technology,Institute of Microelectronics, Peking University,Beijing 100871,China) (2 State Key Laboratory of Precision Measurement Technology and Instruments,Tianjin University,Tianjin 300072,China);A Highly Sensitive Local Curvature Metrology for Internal Stress Detection in Thin Films[J];Chinese Journal of Semiconductors;2006-06
2 Huang Qing’an,Liu Zutao,Li Weihua,and Li Qiaoping(Key Laboratory of MEMS of the Ministry of Education,Southeast University,Nanjing 210096,China);A Test System for the in situ Extraction of the Material Parameters of MEMS Thin Films[J];Chinese Journal of Semiconductors;2006-09
【Citations】
Chinese Journal Full-text Database 1 Hits
1 Huang Weidong,Sun Zhiguo,Cai Xia,Luo Le and Cheng Zhaonian(Shanghai Institute of Microsystem and Information Technology,The Chinese Academy of Sciences,Shanghai 200050,China);Distribution of Residual Stress in Packaging Assemblies of Chip on Board[J];Chinese Journal of Semiconductors;2003-06
【Co-citations】
Chinese Journal Full-text Database 3 Hits
1 Peng Yaowei 1,Chan Justy 2,Wang Zhiping 2,and Xiao Fei 1(1 Department of Material Science,Fudan University,Shanghai 200433,China)(2 China Technology Center,Philips Mobile Display Systems,Shanghai 200131,China);Damage of Bonding Force on IC Aluminum Pad in COF Structure[J];Chinese Journal of Semiconductors;2005-01
2 Yang Chunmei Zheng Xiaoling Yu Haizhou (College of Mechanical and Material Engineering, China Three Gorges Univ. ,Yichang 443002, China);Finite Element Analysis of Inner Stress in Epoxy Adhesive Layer[J];Journal of University of Hydraulic and Electric Engineering/yichang;2004-02
3 Xu Jingbo,Zhao Yulong,Jiang Zhuangde,Sun Jian(State Key Laboratory for Mechanical Manufacturing System, Xi′an Jiaotong University,Xi′an 710049,China);Residual Stresses in Monolithic Multi-Sensor Package[J];Journal of Xi'an Jiaotong University;2006-11
【Co-references】
Chinese Journal Full-text Database 10 Hits
1 MEI Nian-song,HUANG Qing-an (Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing210096,China);Beam test structure of MEMS for measuring fracture strength[J];Semiconductor Information;2002-12
2 Rong Hua 1,Huang Qing'an 1,Nie Meng 2 and Li Weihua 1(1 Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing 210096,China) (2 School of Science,Hefei University of Technology,Hefei 230009,China);An Analytical Model for Pull-in Voltage of Doubly-Clamped Multi-Layer Beams[J];Chinese Journal of Semiconductors;2003-11
3 Mei Niansong and Huang Qing'an(Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing 210096,China);Modeling and Simulation of a Test Structure for Measuring Vertical Fracture Strength of MEMS Film[J];Chinese Journal of Semiconductors;2004-01
4 Xu Gaobin and Huang Qing'an.(Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing 210096,China);Design and Simulation of On-Line Test Structure for Thermal Conductivity of Polysilicon Thin Films[J];Chinese Journal of Semiconductors;2004-04
5 Rong Hua 1,Huang Qing'an 1,Nie Meng 2 and Li Weihua 1(1 Key Laboratory of MEMS of Ministry of Education,Southeast University,Nanjing 210096,China) (2 School of Science,Hefei University of Technology,Hefei 230009,China);A Novel Anchor for Microbeam with Perfect Fixed-End Boundary Conditions[J];Chinese Journal of Semiconductors;2004-06
6 Nie Meng 1,2,Huang Qing'an 1,Wang Jianhua 2,Rong Hua 1 and Li Weihua 1(1 Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing 210096,China) (2 School of Science,Hefei University of Technology,Hefei 230009,China);An Electrostatic Actuated Microelectromechanical In-Situ Extracting Method for Material Property of Multi-Layer Film[J];Chinese Journal of Semiconductors;2004-11
7 Zhang Yuxing,Huang Qing’an,and Li Weihua(Key Laboratory of MEMS of Ministry of Education,Southeast University,Nanjing 210096,China);A Novel Surface-Micromachined Structure For On-Line Measuring Thermal Expansion Coefficient of Polysilicon Thin Films[J];Chinese Journal of Semiconductors;2005-04
8 Liu Zutao,Huang Qing’an,and Li Weihua(Key Laboratory of MEMS of Ministry of Education,Southeast University,Nanjing 210096,China);An Optimized Micro-Rotating Structure for Measuring Residual Strain of Thin Films[J];Chinese Journal of Semiconductors;2005-05
9 Zhao Ruofei\ Zhou Xiaodong\ Dai Gance (Lab of Polymer Processing,East China University of Science and Technology);RESEARCH OF INTERFACIAL RESIDUAL STRESS IN FIBER-POLYMER COMPOSITES[J];FIBER REINFORCED PLASTICS/COMPOSITE;2000-04
10 XU Jing, SU Wei (Institute of Electronic Engineering,China Academy of Engineering Physics,Mianyang 621900,China);Study of residual strain in heavily boron-doped silicon cantilever[J];Journal of Transducer Technology;2005-07
【Secondary References】
Chinese Journal Full-text Database 6 Hits
1 LIU Xudong1,2,ZHU Rong2 ,XU Lijun2,ZHANG Fuxing2,LIU Peng2,ZHOU Zhaoying2 1.Key Laboratory of the Electronic Measurement Technology of the National Defense,North University of China,Taiyuan 030051,China; 2.State Key Laboratory of Precision Measurement Technology and Instruments,Tsinghua University,Beijing 100084,China;Research on Flow Sensor System Integrated with Wing of Micro Air Vehicle[J];Chinese Journal of Sensors and Actuators;2009-07
2 DU Li-qun1,ZHU Shen-miao2(1.Key Laboratory for Precision & Non-traditional Machining Technology of the Ministry of Education,Dalian University of Technology,Dalian 116023,China;2.Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology,Dalian 116023,China);Study on internal stress of thick SU-8 layer in MEMS[J];Optics and Precision Engineering;2007-09
3 HUANG Yu-bo1,LI Da-chao1,HU Xiao-tang1,FU Xing1,ZHANG Wen-dong2,HU Chun-guang1(1.State Key Laboratory of Precision Measuring Technology and Instruments,Tianjin University,Tianjin 300072,China;2.National Key Laboratory for Electronic Measurement Technology,North University of China,Taiyuan 030051,China);Curvature measurement of micro cantilever based on phase-stepping microscopic interferometry[J];Optics and Precision Engineering;2007-09
4 DU Li-qun1,2,ZHU Shen-miao2,YU Li-chuan2 (1.Key Laboratory for Precision & Non-traditional Machining Technology of the Ministry of Education,Dalian University of Technology,Dalian 116024,China;2.Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology,Dalian 116024,China);Effect of post exposure bake temperature on thermal swelling of SU-8 photoresist[J];Optics and Precision Engineering;2008-03
5 ZHU Shen-miao1,2,DU Li-qun1,2,LIU Chong1,YU Li-chuan2,WANG Zhi-hong1(1.Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education,Dalian University of Technology,Dalian 116023,China;2.Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology,Dalian 116023,China);Application of Fuzzy Neural Network in the Internal Stress of SU-8 Photoresist[J];Nanotechnology and Precision Engineering;2007-04
6 ZHANG Dongzhi,HU Guoqing (School of Mechanical and Automotive Engineering,South China University of Technology,Guangzhou 510640,China);Key Technologies of Micro-electromechanical System and Its Recent Progress[J];Piezoelectrics & Acoustooptics;2010-03
【Secondary Citations】
Chinese Journal Full-text Database 1 Hits
1 Sun Zhiguo,Zhang Qun,Huang Weidong,Jiang Yuqi,Cheng Zhaonian and Luo Le(Shanghai Institute of Microsystem and Information Technology,The Chinese Academy of Sciences,Shanghai 200051,China);Evolution Residual In-Plane Stress During Curing Process and Thermal Treatment of COB Packages[J];Chinese Journal of Semiconductors;2002-08
©2006 Tsinghua Tongfang Knowledge Network Technology Co., Ltd.(Beijing)(TTKN) All rights reserved