Full-Text Search:
Home|Journal Papers|About CNKI|User Service|FAQ|Contact Us|中文
《Chinese Journal of Semiconductors》 2005-05
Add to Favorite Get Latest Update

Simulation of Vacuum Package for MEMS Devices with Solder Bonding

Cheng Yingjun,Jiang Yuqi,Xu Wei,and Luo Le(State Key Laboratory of Transducer Technology,Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences,Shanghai 200050,China)  
By applying vacuum physics to typical solder-bon ding vacuum packaging process of MEMS devices,the mathematical and physical model between vacuum degree of cavity to be packaged and gas absorption and desorption,gas penetration,gas flowage through little hole,and steam pressure of materials is established and its arithmetic is ascertained with numerical simulation method.The veracity of the simulation results is validated by experiments and the effect of the size of capillary hole on vacuum degree is analyzed.The parametrical modeling,simulation,and optimization design of vacuum package process of MEMS devices are realized.
【Fund】: 国家高技术研究发展计划资助项目(批准号:2003AA40415)~~
【CateGory Index】: TN405
Download(CAJ format) Download(PDF format)
CAJViewer7.0 supports all the CNKI file formats; AdobeReader only supports the PDF format.
Chinese Journal Full-text Database 5 Hits
1 Zhang Peijun and Huang Qing’an ( Microelectronic Center,Southeast University,N anjing 2 10 0 96 ,China);Simulation of Anisotropic Etching of Silicon Based on MATLAB[J];Chinese Journal of Semiconductors;2002-04
2 Ning Jin and Liu Zhongli(Microelectronics R&D Center,Institute of Semiconductors,The Chinese Academy of Sciences,Beijing 100083,China);Simulation of Performance and Optimal Design of Condenser Microphone[J];Chinese Journal of Semiconductors;2003-08
3 Mei Niansong and Huang Qing'an(Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing 210096,China);Modeling and Simulation of a Test Structure for Measuring Vertical Fracture Strength of MEMS Film[J];Chinese Journal of Semiconductors;2004-01
4 SUN Kehao 1,2 QIAN Jin 1 ZHANG Lixian 1 YU Tongxi 3 ZHAO Yapu 1 (1.IAA, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China) (2.State Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, CAS, Beijing 100;COMPUTER-AIDED DESIGN AND SIMULATION FOR MEMS DEVICES[J];Journal of Mechanical Strength;2001-04
5 XU Shu shen (Gansu University of Technology, Lanzhou 730050, China);Calculating Way on Time of Filling Gas into the Vacuum Container[J];VACUUM;2000-02
Chinese Journal Full-text Database 10 Hits
1 YAO Ping1,YAN Wei-ping1,MA Ling-zhi2,DU Li-qun2,GUO Ji-hong2(1.College of Elct.and Info.Engin.Dalian University of Technology,Dalian 116023,China;2.The Research Center of Micro-systen,Dalian University of Technology,Dalian 116024,China);Anisotropic Etching Micro Dynamic Simulation of Crystalline Silicon[J];Micronanoelectronic Technology;2005-06
2 Huang Qing’an,Liu Zutao,Li Weihua,and Li Qiaoping(Key Laboratory of MEMS of the Ministry of Education,Southeast University,Nanjing 210096,China);A Test System for the in situ Extraction of the Material Parameters of MEMS Thin Films[J];Chinese Journal of Semiconductors;2006-09
3 Zhang Han and Li Weihua(Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing 210096, China);A novel method for generating a rectangular convex corner compensation structure in an anisotropic etching process[J];Journal of Semiconductors;2009-07
4 Zhang Han and Li Weihua (Key Laboratory of MEMS of the Ministry of Education,Southeast University,Nanjing 210096,China);A novel compensation method for polygonized mesa structures on(100) silicon substrate[J];Journal of Semiconductors;2010-06
5 WANG Hong-wei,TENG Gong-qing,QI Chen-jie,JIANG Shi-yu(Physics and Mathematics Institute,Beijing Information Science and Technology University,Beijing 100085,China);The Sense Organ's Research of Silicon Micro-Machined Swing Gyroscope for Circumrotation[J];Chinese Journal of Sensors and Actuators;2007-11
6 TAN Yi-yong,LU Gui-zhang,ZHAO Xin,WANG Lei (Institute of Robotics and Information Automatics System, Nankai University, Tianjin 300071, China);IP Library-Based MEMS Design System[J];Chinese Journal of Sensors and Actuators;2008-02
7 SUN Hui-qin1,LIU Zhi-lan2,LI Xin1,LIU Nan-ping3,LI Feng41.College of Electronic Information,Tianjin Professional College,Tianjin 300402,China;2.Laboratory,Tianjin Second Hospital,Tianjin 300000,China;3.College of Physics and Electronic Information,Tianjin Normal University,Tianjin 300074,China;4.Automation Department,Shanghai JiaoTong University,Shanghai 200030,China;Design of Single Cell Image Observation System Based on Microfluidic Chip[J];Chinese Journal of Sensors and Actuators;2008-12
8 ZHANG Peng,WANG Jing*(School of Electronic and Information Engineering,Dalian University of Technology,Dalian Liaoning 116023,China);Study of SnO_2 Formaldehyde Gas Sensor Based on Plane Technology[J];Chinese Journal of Sensors and Actuators;2009-01
9 GONG Ming-ju1,2,DENG Yue2,MA Jun2,TANG Liang2,QIAO Dong-hai2,HE Qing2,WANG Meng-jiao2(1.School of Electronics Information and Communications Engineering ,Tianjin University of Technology,Tianjin 300191,China;2.Acoustic MEMS Lab,Institute of Acoustics, Chinese Academy of Sciences, Beijing 100080,China);Research on Condenser High Sensitivity Low Frequency Microphone Based on Circular Silicon Diaphragm[J];Chinese Journal of Sensors and Actuators;2009-02
10 CHENG Ying-jun, ZHU Rui, XU Wei, LUO Le Information Technology,The Chinese Academy of Science,Shanghai 200050,China);Modelling and simulation of vacuum packaging of MEMS devices[J];Journal of Transducer Technology;2004-12
China Proceedings of conference Full-text Database 4 Hits
1 Wang Lei,Zhao Xin,Lu Guizhang Institute of Robotics and Automatic Information System,Nankai University,Tianjin 300071,P.R.China;Parameterized MEMS Device Visualized Modeling Method-Virtual Assembly[A];[C];2008
2 Wang Lifeng Huang Qing'an Key Laboratory of MEMS of Ministry of Education,Southeast University,Nanjing,210096;Electrical Measurement of Fracture Strength of Polysilicon[A];[C];2005
3 Liu Zutao Huang Qing'an Li Weihua Key Lab of MEMS of Education Ministry, Southeast University, Nanjing,210096;Measurement System for In Situ Extracting Material Parameters of Polysilicon Film[A];[C];2005
4 Zhang Baosen~*,Xie Jihui,Du Chunlin,Xu Zhongxu,Tian Shuai (Beijing Institute of Satellite Environment Engineering,Beijing,100094,China);Development of Auxiliary Manual Repressing Unit for Astronaut-Module-Spacesuit Simulation Test[A];[C];2008
Chinese Journal Full-text Database 5 Hits
1 TIAN Bin, HU Ming(Sch of Elct Info Engin,Tianjin University,Tianjin 300072,China);Development and trends of MEMS packaging technology[J];Journal of Transducer Technology;2003-05
2 Xian Fei (Fiberhome Telecommunication Co., Ltd, Hubei Wuhan 430074,China );The Research of Reflow Soldering[J];Electronics & Packaging;2005-03
3 WANG Yang yuan,WU Guo ying,HAO Yi long,ZHANG Da cheng, XIAO Zhi xiong,LI Ting,ZHANG Guo bing,ZHANG Jin wen(Institute of Microelectronics,Peking University,Beijing 100871,China);Study of Silicon-Based MEMS Technology and Its Standard Process[J];Acta Electronica Sinica;2002-11
4 YAO Yahong, GAO Zhongyu, LU Miao  , ZHAO Yongjun, ZHAO Yanjun  Department of Precision Instruments and Mechanology, Tsinghua University, Beijing 100084, China; Hebei Semiconductor Research Institute, Shijiazhuang 050051, Chin;Study on fabrication of micromechanical inertial instruments with bulk silicon dissolved wafer process[J];JOURNAL OF TSINGHUA UNIVERSITY(SCIENCE AND TECHNOLOGY);1998-11
5 HU Ming,CUI Meng,TIAN Bin,DOU Yan-wei (School of Electronic Information Engineering, Tianjin University,Tianjin 300072,China);Present Status and Future of CMOS MEMS Technology[J];Piezoelectrics & Acoustooptics;2004-04
【Secondary Citations】
Chinese Journal Full-text Database 3 Hits
1 MEI Nian-song,HUANG Qing-an (Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing210096,China);Beam test structure of MEMS for measuring fracture strength[J];Semiconductor Information;2002-12
2 CHEN Jing,LIU Li tian and LI Zhi jian[KH2D][WT6BX](Institute of Microelectronics,Tsinghua University,Beijing 100084,China)[WT5”HZ];Dynamic Behaviour of Miniature Microphone with Corrugated Membrane: Top down Design with EDA/CAD[J];Chinese Journal of Semiconductors;2001-07
3 Zhang Qingxin; Liu Litian and Li Zhijian (Institute of Microelectronics, Tsinghua University, Beijing 100084)Received 13 Octorber 1995, revised manuscrip received 10 January 1996;New Method of Convex Corner Compensation in Anisotropic Etching of (100) Si in KOH[J];CHINESE JOURNAL OF SEMICONDUCTORS;1996-12
©2006 Tsinghua Tongfang Knowledge Network Technology Co., Ltd.(Beijing)(TTKN) All rights reserved