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Simulation of Vacuum Package for MEMS Devices with Solder Bonding

Cheng Yingjun,Jiang Yuqi,Xu Wei,and Luo Le(State Key Laboratory of Transducer Technology,Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences,Shanghai 200050,China)  
By applying vacuum physics to typical solder-bon ding vacuum packaging process of MEMS devices,the mathematical and physical model between vacuum degree of cavity to be packaged and gas absorption and desorption,gas penetration,gas flowage through little hole,and steam pressure of materials is established and its arithmetic is ascertained with numerical simulation method.The veracity of the simulation results is validated by experiments and the effect of the size of capillary hole on vacuum degree is analyzed.The parametrical modeling,simulation,and optimization design of vacuum package process of MEMS devices are realized.
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