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《CHINESE JOURNAL OF SEMICONDUCTORS》 1996-05
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Thermal Analysis of High Density Packages

Wang Shiping; Luan Yongwei and Zhao Dunshu(Xidian University, Xi'an 710071 )Received 11 December 1994, revised manuscript received 15 August 1995  
Abstract In this paper, several factors (include air velocity, power spot distribution and heat spreader size)that influence the junctiontemperature are dicussed, wih aid of a 3-dimensional finite differential method and an analysis of a typical package thermal resistance network.
【CateGory Index】: TN405
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