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《Journal of Northern Jiaotong University》 2001-06
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AC Impedance Study of Electroless Nickel Induced by Photosensitizer

YANG Yu_guo 1, XU Yun_hua 1,SUN Dong_bai 2, YANG De_jun 2 (1.College of Sciences, Northern Jiaotong University, Beijing 100044,China; 2.School of Material Science, University of Science and Technology Beijing,Beijing 100083,China)  
The mechanism of electroless nickel induced by photosensitizer under illumination was studied with AC impedance method. The results show that the adsorption of H 2PO - 2 plays a key role in the process and the photosensitizer only plays the role of electron transfer.
【CateGory Index】: TQ153
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【Citations】
Chinese Journal Full-text Database 1 Hits
1 YANG Yuguo, SUN Dongbai, YANG Dejun (Department of Surface Science and Corrosion Engineering, University of Science and Technology Beijing, Beijing 100083);ELECTROLESS NICKEL PLATING BY INDUCED PHOTOSENSITIZER[J];CORRSION SCIENCE AND TECHNOLOGY PROTECTION;1998-01
【Co-citations】
Chinese Journal Full-text Database 2 Hits
1 GAO Shu-xuan,LIU Gui-chang,ZHANG Ru-zhi,CHEN Ye (School of Chemical Engineering,Dalian University of Technology,Dalian 116012,China);Development of Electroless Plating in Ultrasonic Field[J];Surface Technology;2004-02
2 ZOU Jian-ping , LIU Xian-ze, XING Qiu-ju, WEI Dao-sheng, LIN Wan-feng, LIU Sheng-bin, LIANG Zhen, LI Guang-ming School of Environment and Chemical Engineering, Nanchang Hangkong University, Nanchang 330063, China;New development of the technology of middle and low temperature electroless nickel plating[J];Electroplating & Finishing;2009-05
【Co-references】
Chinese Journal Full-text Database 10 Hits
1 Xia Chuanyi,Liu Dongwei(The 13th Institute,Mnistry of EI,Shijiazhuang,050051);A New Type of Metallization Technology for Ceramic Circuit Substrates[J];SEMICONDUCTOR INFORMATION;1994-04
2 SONG Yuan?wei, ZHAO Bin, SUN Cheng?xu (East China University of Science and Technology, Shanghai 200237, China);Electroless Copper Platig and Its Application to Glass Industry[J];GLASS & ENAMEL;1999-05
3 ;Study of Electroless Plating Copper Process on Ceramics Substrate[J];Surface Technology;1999-03
4 SUN Hua, FENG Li-ming (Department of Materials and Engineering, Shandong Institute of Architecture and Engineering, Jinan 250014, China);Study on Stabilizers for Electroless Ni-P Alloy Plating[J];Surface Technology;2004-05
5 OU Xue-mei , ZHU Zheng-wang , CUI Yong-li(School of Material Science and Engineering , China University of Mining and Technology, Xuzhou 221008, China);Effects of Stabilizers on Electroless Copper Plating on theSurface of 96Al_2O_3 Ceramics[J];Surface Technology;2005-01
6 ;A Study on the Effects of Additives on Electroless Copper Deposition by Electrochemical Method[J];MATERIAIS PROTECTION;1997-01
7 SHEN Wei (33);Depositing Processess of Electroless Cu Plating and Properties of Deposit[J];MATERIAIS PROTECTION;2000-01
8 ZHANG Dao-li, GONG Shu-ping, ZHOU Dong-xiang;Speciation in Electroless Copper Solutions and Roles of Complexing Agents[J];MATERIAIS PROTECTION;2000-04
9 ZHONG Li-ping, ZHAO Zhuan-qing, HUANG Feng-chun (Department of Chemistry, Shanxi University, Taiyuan,P.R.China, 030006).;Deposition Rate and Stability of Electroless Cu Plating Solution[J];Materiais Protection;2001-06
10 XU Rui-dong, GUO Zhong\|cheng (Faculty of Material and Metallurgical Engineering, Kunming University of Science and Technology, Kunming, 650093, China);New Brightener for Electroless Nickel Plating[J];Materiais Protection;2002-06
【Secondary Citations】
Chinese Journal Full-text Database 1 Hits
1 Wang Kunlin Tsinghua University;Laser Induced Deposition Technologies and Their Applications[J];Surface Technology;1993-06
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