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《JOURNAL OF BEIJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS》 2000-01
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Finite Element Analysis of Temperature Field of PCB and Components

LI Xiao ming L Shan wei GAO Ze xi (Beijing University of Aeronautics and Astronautics,Dept. of Electronic Engineering)  
Heat transfer was introduced. The finite element method (FEM) is used to investigate steady state two and three dimensional heat transfer in dual in line component and PCB. Two methods are compared through real examples' temperature distribution. And experiments with point test method are done to compare with the results of calculated and results are much in accord with each other. Conclusion is also given that three dimensional finite element method is more complex and with it more particular messages could be obtained.
【Fund】: 国家部委基金
【CateGory Index】: TN401
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