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Photoelectronic Imaging: Towards the New Century

ZHOU Li wei (Dept. of Optical Engineering, Beijing Institute of Technology, Beijing100081, China)  
Over half a century, photoelectronic imaging which consists mainly of low light level imaging and thermal imaging, has made marked progress, and demonstrated brilliant prospects. In the area of low light level imaging, image intensification technique of the first, second and third generation, vacuum and solid state imaging pickup, as well as photon counting imaging systems have successively made their appearance. In the area of thermal imaging, cooled matrix thermal imaging techniques of the first, second, and third generation, and thermal imaging with uncooled matrices have made their advances. The present paper reviews the photoelectronic imaging technique since the 1930's and gives its prospects concerning developments in the new century on low light level image intensification of the fourth generation, on new low light level imaging pickup techniques as well as on advanced focal plane array (FPA) and uncooled thermal imaging.
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