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《Fiber Reinforced Plastics/Composites》 2009-03
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CUI Yi,LIU Jing-lin,YANG Ming(Beijing Institute of Aeronautical Materials,AVICI,100095,China)  
Through infrared analysis,it can be found that the boron exists in the molecular chain as chemical bonds in the boron phenolic resin.Thermal gravimetric analysis result shows the initial decomposition temperature of this boron phenolic resin is 220℃,the residual carbon rate at 800℃ is about 65 percent.The maintain rate of boron phenolic resin composite material on its mechanical properties at 250℃ is about 70 percent,so it can be used as a high temperature structural material.
【CateGory Index】: TQ323.1
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