Structure of the Compound plating of Ni-P Alloy and Its Wearing Properties
Wu Yucheng & Wei Chunjin (Hefei Industrial College)
Thes paper studies the structure of the compound silicon carbide plating of electroless plating of Ni-p alloy as well as its wearing properties and mechanism. The compound plating is formed by means of adding silicon carbide particles to the electroless solution of Ni-P alloy. The mechanical combination of silicon carbide particles with Ni-P substrates keeps the structure of Ni-P alloy and improves the hardness of the alloy and wearing properties.