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《Packaging Engineering》 2001-06
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Development of 3D parameter packing case CAD system

YAO Jin, DU Hong wei (Sichuan University, Chengdu 610065,China)  
In this paper the design scheme and realization method for 3D packing case CAD system is introduced. The 3D parameter packing case CAD system is developed and the rapidly modeling of packing case is implemented.
【CateGory Index】: TB482;TP391.72
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