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《Journal of Chongqing University of Posts and Telecommunications(Natural Science)》 2007-06
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Flip-chip packaging technology for high-power white light LED

GUAN Ming,DONG Hui-ning,TANG Zheng-wei,LI Qiu-jun(College of Electronic Engineering,Chongqing University of Posts and Telecommunications,Chongqing 400065,P.R.China)  
A flip-chip packaging technology for high-power and high-brightness LED which has well high heat-conductance.The LED chips reflecting light from backside are soldered onto a silicon substrate with electrostatic discharge(ESD) control circuit.This packaging improves the luminescence and the radiate-heat capableness of the traditional LED,and it efficiently lengthens LED chip's life and reduces the cost of manufacture.
【Fund】: 重庆市教委资助项目(KJ060515 KJ050502)
【CateGory Index】: TN312.8
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