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《Journal of Changchun University of Science and Technology(Natural Science Edition)》 2014-01
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Re-development Based on the UG of Dissipating Heat Device Parameterization

ZHANG Rongjia;FU Yun;School of Optoelectronic Engineering,Changchun University of Science and Technology;  
Through a lot of practical summary,according to the heat sink three main structures,namely there are joint type radiating device,cutting type heat radiating device,forging type heat radiating device. On UG platform,two times the development of language GRIP are used for parameterizing modeling. So designers can differed in the size of the instrument assembly. In accordance with the requirements of number and fin thickness size adjustment can also be processed. RD personnel of the design cycle is saved and work efficiency is improved.
【CateGory Index】: TH74
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