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《Chinese Journal of Sensors and Actuators》 2006-05
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Finite Element Analysis of Temperature Effect in Polymer Hot Embossing

XU Min~1 , LUO Yi~ 1* ,WANG Xiao-dong~1 , LI Nan~2 , LIU Chong~2 1.The Key Laboratory for Dalian University of Technology Precision & Non-traditional Machining of Ministry of Education, Dalian 116023, China; 2.The Key Laboratory for Micro/Nano Technology and System of Liao Ning Province, Dalian 116023, China  
Temperature, pressure and time are three major control conditions in hot embossing process, and temperature is the most important one. Creep experiments at several temperatures have been conducted to study the mechanical property of PMMA in this paper. General Kelvin model has been used to fit the creep curve of PMMA. The relaxation property was obtained from conversion between creep compliance and relaxation modulus. WLF equation parameters were obtained at reference temperature 105℃ by shifting the creep curve along time logarithm axis. Based on viscoelastic material model, simulation of hot embossing process was carried out. It is shown that good filling can be obtained at 120℃, and the filling at glass transition temperature represents bad replicative quality. The simulation result is proved by hot embossing experiments.
【Fund】: 辽宁省博士启动基金资助(20041073)
【CateGory Index】: O482
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