Full-Text Search:
Home|Journal Papers|About CNKI|User Service|FAQ|Contact Us|中文
《Chinese Journal of Sensors and Actuators》 2007-11
Add to Favorite Get Latest Update

The Sense Organ's Research of Silicon Micro-Machined Swing Gyroscope for Circumrotation

WANG Hong-wei,TENG Gong-qing,QI Chen-jie,JIANG Shi-yu(Physics and Mathematics Institute,Beijing Information Science and Technology University,Beijing 100085,China)  
The capacitance sense principle of silicon micro-machined swing gyroscope for circumrotation is introduced.The structure of silicon vibration element was given.After calculating the relationship of sensing capacitance and angle velocity,the relationship between the electricity bridge output and angle velocity was obtained.Using MEMS technic to process the silicon vibration element,the technical feature is that two side lithography and etching had being used time after time.The sense organ's fabrication of silicon micro-machined gyroscope was proposed,the four sense's capacitance has been tested.It indicated that the four capacitance is smaller than calculation result.
【Fund】: 北京市教育委员会科技发展计划项目资助(KM200611232011)
【CateGory Index】: TP212
Download(CAJ format) Download(PDF format)
CAJViewer7.0 supports all the CNKI file formats; AdobeReader only supports the PDF format.
【Citations】
Chinese Journal Full-text Database 6 Hits
1 WANG Hong wei, ZHU Jia jin,ZHANG Wei, ZHANG Fu xue (Research Centre of Sensor Technology, Beijing Information Technology Institute, Beijing 100010, China );Dynamics analysis and imitation of silicon micro-machined gyroscope using for circumrotation carrier[J];Micronanoelectronic Technology;2003-Z1
2 Mei Niansong and Huang Qing'an(Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing 210096,China);Modeling and Simulation of a Test Structure for Measuring Vertical Fracture Strength of MEMS Film[J];Chinese Journal of Semiconductors;2004-01
3 Li Xinxin Bao Minhang(Sensor Lab. Dept. Electronic Engineering, Fudan University);Improvement for Si Capacitive Mechanical Structures Using a Kind of Maskless Etching Process[J];Journal of Transcluction Technology;1996-01
4 Ren Jianjun Yang Heng Li Xinxin shen Shaoqun Bao Minhang(Sensor Lab, Dept. of Electronic Engineering, Fudan University, Shanghai 200433,State Key Laboratories of Transducer Technology, Chinese Academy of Sciences);Study on Si Low Pressure Sensor with a Novel Single-sided Multilevel Structure[J];Journal of Transcluction Technology;1997-04
5 WANG Hong-wei, ZHU Jia-lin, ZHANG Wei, ZHANG Fu-xue (Res Centre of Sensor Technology, Beijing Information Technology Institute, Beijing 100101,China);Angular rate sensor for rotating carrier[J];Journal of Transducer Technology;2003-09
6 WANG Hong-wei1, ZHU Jia-lin1 , ZHANG Wei1, ZHANG Chao-min2 , ZHANG Fu-xue1 (1. Research Centre of Sensor Technology, Beijing Information Technology Institute, Beijing 100101, China; 2. Science Institute of Jiamusi University, Jiamusi 154004, China);A Model of Angular Rate Sensor for Circumrotated Carrier[J];Journal of Chinese Inertial Technology;2003-03
【Co-citations】
Chinese Journal Full-text Database 10 Hits
1 WANG Hong-wei,TENG Gong-qing,QI Chen-jie,JIANG Shi-yu (The School of Science,Beijing Information Science and technology University,Beijing 100085,China);Research of a Rotating Silicon Micro-Machined Gyroscope[J];Micronanoelectronic Technology;2007-Z1
2 Cheng Yingjun,Jiang Yuqi,Xu Wei,and Luo Le(State Key Laboratory of Transducer Technology,Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences,Shanghai 200050,China);Simulation of Vacuum Package for MEMS Devices with Solder Bonding[J];Chinese Journal of Semiconductors;2005-05
3 Huang Qing’an,Liu Zutao,Li Weihua,and Li Qiaoping(Key Laboratory of MEMS of the Ministry of Education,Southeast University,Nanjing 210096,China);A Test System for the in situ Extraction of the Material Parameters of MEMS Thin Films[J];Chinese Journal of Semiconductors;2006-09
4 MING Liang,WANG Yin-nian,WANG Jia-guang,ZANG Fu-xue(Sensor Research Center,Beijing Information Technology Institute,Beijing 100101,China);Design of a signal detection circuit of silicon micromachined gyroscope[J];Journal of Beijing Institute of Machinery;2006-04
5 Ren Jianjun Yang Heng Li Xinxin shen Shaoqun Bao Minhang(Sensor Lab, Dept. of Electronic Engineering, Fudan University, Shanghai 200433,State Key Laboratories of Transducer Technology, Chinese Academy of Sciences);Study on Si Low Pressure Sensor with a Novel Single-sided Multilevel Structure[J];Journal of Transcluction Technology;1997-04
6 Li Xinxin Yang Heng Bao Minhang Shen Shaoqun(Sensor Laboratory, Dept. of Electronic Engineering, Fudan University, Shanghai 200433);A Study on the Principles and the Compensation for Maskless-etched Convex-corner Undercutting[J];Journal of Transcluction Technology;1998-03
7 SUN Hui-qin1,LIU Zhi-lan2,LI Xin1,LIU Nan-ping3,LI Feng41.College of Electronic Information,Tianjin Professional College,Tianjin 300402,China;2.Laboratory,Tianjin Second Hospital,Tianjin 300000,China;3.College of Physics and Electronic Information,Tianjin Normal University,Tianjin 300074,China;4.Automation Department,Shanghai JiaoTong University,Shanghai 200030,China;Design of Single Cell Image Observation System Based on Microfluidic Chip[J];Chinese Journal of Sensors and Actuators;2008-12
8 ZHANG Peng,WANG Jing*(School of Electronic and Information Engineering,Dalian University of Technology,Dalian Liaoning 116023,China);Study of SnO_2 Formaldehyde Gas Sensor Based on Plane Technology[J];Chinese Journal of Sensors and Actuators;2009-01
9 WANG Li-feng,HUANG Qing-an,LI Wei-hua(Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing 210096, China);Method for Electrical Measurement of Fracture Strength of Surface Micromachined Polysilicon Beams Based on a Thermal Actuator[J];Journal of Electron Devices;2005-04
10 Wu Zhongcheng Ge Yu Yu Chengduan The Institute of Intelligent Machines, Chinese Academy of Science the key labortories of transducers technoloy,Hefei 230031;E-type 3-D Accelerometer's Design Based on Thick Film Technology[J];Instrument Technique and Sensor;2001-09
China Proceedings of conference Full-text Database 3 Hits
1 WANG Hong-wei TENG Gong-qing QI Chen-jie JIANG Shi-yu (The School of Science,Beijing Information Science and technology University,Beijing 100085,China);Research of a Rotating Silicon Micro-Machined Gyroscope[A];[C];2007
2 Wang Lifeng Huang Qing'an Key Laboratory of MEMS of Ministry of Education,Southeast University,Nanjing,210096;Electrical Measurement of Fracture Strength of Polysilicon[A];[C];2005
3 Liu Zutao Huang Qing'an Li Weihua Key Lab of MEMS of Education Ministry, Southeast University, Nanjing,210096;Measurement System for In Situ Extracting Material Parameters of Polysilicon Film[A];[C];2005
【Secondary Citations】
Chinese Journal Full-text Database 3 Hits
1 MEI Nian-song,HUANG Qing-an (Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing210096,China);Beam test structure of MEMS for measuring fracture strength[J];Semiconductor Information;2002-12
2 Li Xinxin Bao Minhang(Sensor Lab. Dept. Electronic Engineering, Fudan University);Improvement for Si Capacitive Mechanical Structures Using a Kind of Maskless Etching Process[J];Journal of Transcluction Technology;1996-01
3 Ruan Aiwu Fen Peide (Northwestern Po1ytechnical University)(Flight Automatic Contro Research Institute) (Nanjing University of Aeronautics and Astronautics);New Development and Analysis of Silicon Micromachined Gyroscopes[J];JOURNAL OF CHINESE INERTIAL TECHNOLOGY;1998-02
©2006 Tsinghua Tongfang Knowledge Network Technology Co., Ltd.(Beijing)(TTKN) All rights reserved