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Structure Design of MEMS Piezoelectric Vibration Energy Harvester with Wafer-Level Low Vacuum Packaging

ZHANG Yingyi;WEN Zhiyu;DENG Licheng;No.44 Research Institute of CETC;National Key Laboratory of Fundamental Science of Micro/Nano-Device and System Technology;College of Optoelectronic Engineering of Chongqing University;  
MEMS low vacuum packaging technology can provide low damping environment for the movable part ofMEMS devices,decrease the energy loss,and improve the energy conversion efficiency of the devices. So it has im-portant research significance and application prospects,and becomes the study hotspot and difficulty of MEMS tech-nology. In order to further improve the output performance of MEMS piezoelectric vibration energy harvester,thispaper proposes a new structure of wafer-level low vacuum packaged and piezoelectric cantilever array fixed on onesharing mass based MEMS piezoelectric vibration energy harvester,and optimization design and analysis for struc-ture parameters of the device is done by finite element method. The output performance is simulated at the opti-mized parameters:at 610 Hz and 2 g acceleration,the output voltage of the device is 8.88 V,and the output poweris 1 220 m W,which can satisfy the need of practical application. The process flow is designed on the basis of the de-vice structure,it will be of great importance in the realization of low vacuum packaging structure and the explorationof package technology.
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