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《Transducer and Microsystem Technologies》 2006-12
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MEMS packaging technology

HU Xue-mei,LJun-xia(Department of Electrical Engineering,Henan Polytechnic Institute,Nanyang 473009,China)  
The microelectromechanical system(MEMS) packaging technology is a key technique for MEMS based on microelectronics packaging.Function,some particularities and classification of MEMS packaging technologies are put forward,some important and advanced technologies of MEMS packaging are introduced,such as bonding technology,top bottom ball grid array technology(TB-BGA),flip-chip technology(FCT),multi-chip packaging(MCP) technology and three dimensions(3-D) technology.Finally,the trends of development and research for MEMS packaging are discussed.
【CateGory Index】: TN405
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【References】
Chinese Journal Full-text Database 3 Hits
1 QIAN Jian,ZHANG Qing-chuan,WU ling,CHENG Teng(CAS Key Laboratory of Mechanical Behavior and Design of Materials,University of Science and Technology of China,Hefei 230027,China);On the Temperature Distribution in Localized Heating for Low Temperature Sealing of Germanium-Borosilicate Glass[J];Journal of Experimental Mechanics;2009-05
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【Co-citations】
Chinese Journal Full-text Database 10 Hits
1 HU Hao,DONG Jingxin,WAN Caixin,LIU Yunfeng(Department of Precision Instruments and Mechanology,Tsinghua University,Beijing 100084,China);Error analysis of capacitance detector diodes in micro machined accelerometers[J];Journal of Tsinghua University(Science and Technology);2008-11
2 HU Hao, DONG Jingxin, WAN Caixin, LIU Yunfeng(Department of Precision Instruments and Mechanology, Tsinghua University, Beijing 100084, China);Error analysis of capacitance detector diodes in micro machined accelerometers[J];Journal of Tsinghua University(Science and Technology);2008-11
3 ZHANG Nan,WEN Jiang-chuan,ZHANG Fu-xue(Sensor Research Ctr,Beijing Information Technoligical Institute,Beijing 100101,China;Beijing China Key Laboratory for Sensor,Beijing 100101,China);Research on Electrical Model of Silicon Micromachined Gyroscope Driven by Carrier[J];Journal of Shihezi University(Natural Science);2006-03
4 MA Shuang-yan1,WANG En-ze1,LU Wei-yuan2,WANG Xin2(1.Dept.of Mater.Sci.and Eng.,Southwest University of Science and Technology,Mianyang 621000,China; 2.Yijing Changyun Super-hard Material Co.,Ltd.,Mianyang 621000,China);Study on Graphitization of Diamond in Copper/diamond Composite[J];Hot Working Technology;2007-20
5 ZHAO De-shen,HU Xue-mei (Department of Electrical Engineering,Henan Polytechnic Institue,Nanyang 473009,China);Structure Analysis on Variable-capacitance Inertial Sensor[J];Journal of Wuhan University of Technology;2009-06
6 LIU Wen-ming,WANG Zhi-yong,BAO Jian-bin,WANG Xue-fang,GUAN Rong-feng,ZHU Fu-long,LIU Sheng(Huazhong University of Science and Technology,Wuhan 430074,China);Research on Vacuum Packaging of Micro-gyroscope with Vacuum Reflow Furnace[J];Microfabrication Technology;2006-02
7 PAN Kai-lin,LI Peng,NING Ye-xiang,YAN Yi-lin(School of Mechanical & Electronical Engineering,Guilin University of Electronic Technology,Guilin 541004,China);MEMS Packaging Technology[J];Microfabrication Technology;2008-01
8 Zhang Shuai,Jia Yuqin;Research status and new development of MEMS technology[J];Machinery Manufacturing Engineer;2005-09
9 YANG Hui-juan,WANG zhi-fa,JIANG Guo-sheng,WANG Hai-shan,TANG Ren-zheng(School of Materials Science and Engineering,Central South University,Changsha 410083,China);Preparation of Kovar/Cu/Kovar Laminates by Rolling Combination[J];Rare Metals and Cemented Carbides;2004-02
10 ZHANG Dongzhi,HU Guoqing (School of Mechanical and Automotive Engineering,South China University of Technology,Guangzhou 510640,China);Key Technologies of Micro-electromechanical System and Its Recent Progress[J];Piezoelectrics & Acoustooptics;2010-03
【Co-references】
Chinese Journal Full-text Database 7 Hits
1 PAN Jian-feng1,ZHANG Hui-feng1,XUE Hong1,LI De-tao1 (1.School of Energy and Pow.Eng.,Jiangsu Univ.,Zhenjiang 212013,China; 2.School of Mech.Eng.,California Polytechnic State Univ.,Los Angeles CA91768,USA);Numerical simulation of combustor with two annular fins of micro thermophotovoltaic systems[J];Journal of Thermal Science and Technology;2007-04
2 LIU Jun ying 1,2 , CHU Jin kui 2, ZHU Xiang rong 3, HAN Guang ping 2 (1.School of Mechanical Engineering, Shandong University of Technology, Zibo 255049, China; 2. Xi'an University of Technology, Xi'an 710048, China;3.Linzi Heating Power Company, Zibo 255400, China);Development of Microelectromechanical System[J];;2003-01
3 PAN Liang~1, ZHANG Qing-chuan~1, WU Xiao-ping~1, DUAN Zhi-hui~1, CHEN Da-peng~2, WANG Wei-bing~2, GUO Zhe-ying~1 (1. CAS′s Key Laboratory of Mechanical Behavior and Design of Materials (LMBD), University of Science and Technology of China, Hefei 230027; 2. Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029);MEMS Based Optomechanical Infrared Imaging[J];Journal of Experimental Mechanics;2004-04
4 Xiong Zhi-Ming 1) Zhang Qing-Chuan 1) Chen Da-Peng 2) Wu Xiao-Ping 1) Guo Zhe-Ying 1) Dong Feng-Liang 1) Miao Zheng-Yu 1) Li Chao-Bo 2) 1)(CAS Key Laboratory of Mechanical Behavior and Design of Materials, Chinese Academy of Sciences, University of Science and Technology of China, Hefei 230027, China) 2)(Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China);Optical-readout micro-cantilever array IR imaging system and performance analysis[J];Acta Physica Sinica;2007-05
5 ZHANG Yu-de,SUN Dao-heng* (Department of Mechanical and Electrical Engineering,Xiamen University,Xiamen 361005,China);Study of Wavelet Transform to Reduced Order Modeling for MEMS[J];Journal of Xiamen University(Natural Science);2005-S1
6 LIN Ri-le~1, XIE Jia-wei~1,CAI Ping~2, WENG Bang-ying~1, DONG Hong-kui~1, ZHAO Jian-hua~1,WANG Rui~1, ZHANG Qiao-yun~1(1.Sichuan Institute of Piezoelectric & Acoustooptic Technology, Chongqing 400060, China;2.Machanic Department,Chongqing University of Science and Tehnology,Chongqing 400042,China);Application of Bulk Micromachining Technology in MEMS[J];Piezoelectrics & Acoustooptics;2005-03
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1 Wan Yong,Pan Yi,Huang Jian(Wuhan Library of Chinese Academy of Sciences,Wuhan 430071,China);Review on the development policy and measurement of MEMS in main countries/regions[J];Modern Manufacturing Engineering;2012-05
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