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《China Surfactant Detergent & Cosmetics》 2006-03
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Effects of surfactant and aromatic counter ion on Ni-P chemical plating

LIU Shao-you~1,TANG Wen-hua~1,ZHOU Zhi~1,ZOU Yong~1,YANG Hong-yun~1,ZHEN Wei-jun~2(1.Guizhou Normal University,Kaili School,Kaili 556002,China;2.Xinjiang University,Urumqi 830046,China)  
The effects of potassium acid phthalate(PAP),cetyl trimethyl ammonium bromide(CTAB)and cocoanut(acylamide) propyl hydroxyl sulfo-betaine(CAB)on the UV-visible absorption spectra of formulation of chemical plating bath were studied using TU-1900 UV-vis.Based upon the principle of three level experimental design as proposed by Box and Bihnken,the interaction mechanism and the effects of PAP,CTAB and CAB on nickel-phosphorus deposition rate were analyzed with software Statistica 6.0,and the plating layer micromorphology was characterized.The results showed that aromatic counter ion was a good accelerating agent in Ni-P chemical plating;and all the addition of PAP,CTAB or CAB will result in red shift and deformation of absorption spectra of the chemical plating bath.PAP shows positive correlation on absorption intensity and red shift of the plating bath as well as Ni-P deposition rate.Within a certain concentration range,CAB or CTAB will accelerate Ni-P deposition rate.There is synergetic effect when the addition of CTAB is 2.05 mg,and CAB is 2.23 mg respectively in one liter of the plating bath,and a higher Ni-P deposition rate(18.15 μm·h~(-1))with a brilliant plating layer can be obtained.
【Fund】: 贵州省教育厅自然科学基金资助项目(2004222)
【CateGory Index】: TQ153.1
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