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《Materials Protection》 2004-02
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Alkali CyanideFree Copper Electroplating Technology

ZHANG Mei-sheng, ZHANG Bing-qian(Kunshan Tongxin Electroplating Factory, Kunshan 215316, China).  
In order to abate the environmental pollution of cyanide copper electroplating and achieve clean production, experimental and applied study of directly cyanide free copper electroplating technology and bath were carried out for steel and zinc die casting pieces. Results show that the bath has the advantages of simple processing, rational composition and easy maintenance, which main properties as disperse ability approach that of cyanide bath and deep plating is much better. The properties of plating such as bonding on matrix are favorable. Applications approve that the technology has comparative quality as cyanide electroplating, and can be conveniently used as hang plating and barrel plating, either pre electroplating or electroplating for intermediate layer or surface.
【Key Words】: cyanide free electroplating alkali copper electroplating technology
【CateGory Index】: TQ153
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【References】
Chinese Journal Full-text Database 10 Hits
1 WEN Qing,CHEN Jianpei(Guangzhou Etsing Plating Research Institute,Guangzhou 510170,China)Cailiao Baohu 2005,38(4),35~37(Ch).;Progress of Cyanide Free Alkaline Copper Plating Technology[J];Materials Protection;2005-04
2 FENG Li-ting, LIU Qing, FENG Shao-bin, HU Fang-hong, JIANG Yuan-yang ( Department of Chemical Engineering, Zhengzhou Institute of Light Industry, Zhengzhou 450002, China);Improvement of Adhesion of Direct Copper Plating Layer from HEDP Bath[J];Materials Protection;2007-09
3 FENG Shao-bin, SUN Xi-lian, SHANG Shi-bo (Dept. of Material and Chemical Engineering, Zhengzhou University of Light Industry, He'nan Zhengzhou 450002, China);Promoting cyanide-free process, rebuilding image of industry[J];Electroplating & Finishing;2004-02
4 WANG Rui-xiang Wuhan Fengfan Suface Engineering Co., Ltd, Wuhan 430013, China;Neutral non-cyanide copper plating on steel[J];Electroplating & Finishing;2008-01
5 GAO Hai-li, ZENG Zhen-ou, ZHAO Guo-peng College of Chemistry & Chemical Engineering, South China University of Technology, Guangzhou 510641, China;Electrochemical behavior of copper plating on copper electrode in HEDP solution[J];Electroplating & Finishing;2008-08
6 GAO Hai-li,ZENG Zhen-ou,ZHAO Guo-peng College of Chemistry and Chemical Engineering,South China University of Technology,Guangzhou 510641,China;Electrochemical behavior of copper deposit on iron electrode in HEDP bath[J];Electroplating & Finishing;2009-04
7 MA Chun-xia, HU Hui-li*, LI Ning, WEI Zhao-huan School of Chemical Engineering of Harbin Institute of Technology, Harbin 150001, China;Electroplating of Ni_(70)Cu_(30) alloy from pyrophosphate bath[J];Electroplating & Finishing;2009-08
8 FANG Jing-Li Fuzhou Nobel Surface Technology Ltd, Fuzhou Jinshan Incubator of Technology Enterprises, The Second floor, No.3 Building, Fuzhou 350003, China;Review of HEDP direct copper plating process on iron and steel workpiece after 30 years of development—Part I. History and recent 30 years of improvement[J];Electroplating & Finishing;2009-09
9 ZHANG Zi-qiang,ZHAO Yong-wu* (School of Mechanical Engineering,Jiangnan University,Wuxi 214122,China);Cyanide-Free Copper Plating for Iron-Based Components[J];Journal of Jiangnan University(Natural Science Edition);2008-06
10 SHAO Chen,FENG Hui,WEI Ying-ling,SHAO Tong-jing(College of Material and Chemical Engineering,Zheng Zhou Institute of Light Industry,Zheng Zhou 450002,);Study on new technology of electroplating of copper from HEDP[J];Inner Mongolia Petrochemical Industry;2007-02
【Co-references】
Chinese Journal Full-text Database 10 Hits
1 WANG Jian-jun,SONG Wu-lin,GUO Lian-gui(The Analytical and Testing Center,Central China University of Science and Technology,Wuhan 430074,China);Study on the Technology of the Copper Pyrophosphate Plating[J];Surface Technology;2005-06
2 TIAN Chang-chun~1,TIAN Xiu-ming~2(1.Guangdong Good Chemical Science & Technology Co.,Ltd,Nanhai 528247,China;2.Department of Chemical and Life Science,Gannan Teachers College,Ganzhou 341000,China);Choice of Raw Material and Craft Maintenances in Acid Bright Copper Plating[J];Surface Technology;2006-03
3 WU Hui- ming 1 , RANG Jian- qiang 1 , ZUO Zheng- zhong 1 , LIANG Guo-zhu 2, YUAN Guo-wei 2, ZHAN Yi-teng 2, ZHAO Guo - peng (1. College of Chemistry and Molecular Science, Wuhan University, Wuhan 430072; 2. Guangzhou Etsing Plating Research Institute, Guangzhou 510170, China).;Development of Chromium (Ⅲ) Electroplating[J];Materials Protection;2004-08
4 WEN Qing,CHEN Jianpei(Guangzhou Etsing Plating Research Institute,Guangzhou 510170,China)Cailiao Baohu 2005,38(4),35~37(Ch).;Progress of Cyanide Free Alkaline Copper Plating Technology[J];Materials Protection;2005-04
5 CHEN Gao~1,YANG Zhi-qiang~2,LIU Lie-wei~1,PENG Qing-jun~2(1.Department of Chemistry,Huazhong University of Science and Technology,Wuhan 430074;2.Wuhan Institute of Materials Protection,Wuhan 430030,China);Technology for Copper Plating in a Novel Citrate Bath[J];Materials Protection;2005-06
6 GU Mina, FU Bian-hongb, YANG Ming-lia (a. Key Laboratory for China Southwest Resource Exploitation and Environmental Disaster Control Engineering of Ministry of Education; b. College of Resource and Environmental Science, Chongqing University, Chongqing 400044, China).;Progress in Electroplating of Copper from Sulfate Bath[J];Materials Protection;2006-01
7 CHU Rong-bang,GUAN Chun-li,CHU Chun-juan(4 Huju Beilu,Nanjing 210003,China).;Process for Electroplating of Copper in Pyrophosphate Bath[J];Materials Protection;2006-10
8 CHU Rong-bang,GUAN Chun-li,CHU Chun-juan(4 Huju Beilu,Nanjing 210013,China).;Process for Electroplating of Copper in Pyrophosphate Bath[J];Materials Protection;2006-11
9 CHU Rong-bang,GUAN Chun-li,CHU Chun-juan(4 Huju Bei-lu,Nanjing 210013, China).;Process for Electroplating of Copper in Pyrophosphate Bath[J];Materials Protection;2006-12
10 FENG Shan-bin, LIU Qing, FENG Li-ting, BAOXiang(Department of Chemical Engineering, Zhengzhou Institute of Light Industry, Zhengzhou 450002, China).;Study of Potential Artivation of Iron Substrate inElectrodeposilion by Enhanced Raman Spectroscopy[J];Materials Protection;2007-01
【Secondary References】
Chinese Journal Full-text Database 10 Hits
1 WEN Qing,CHEN Jianpei(Guangzhou Etsing Plating Research Institute,Guangzhou 510170,China)Cailiao Baohu 2005,38(4),35~37(Ch).;Progress of Cyanide Free Alkaline Copper Plating Technology[J];Materials Protection;2005-04
2 FENG Shan-bin, LIU Qing, FENG Li-ting, BAOXiang(Department of Chemical Engineering, Zhengzhou Institute of Light Industry, Zhengzhou 450002, China).;Study of Potential Artivation of Iron Substrate inElectrodeposilion by Enhanced Raman Spectroscopy[J];Materials Protection;2007-01
3 FENG Li-ting, LIU Qing, FENG Shao-bin, HU Fang-hong, JIANG Yuan-yang ( Department of Chemical Engineering, Zhengzhou Institute of Light Industry, Zhengzhou 450002, China);Improvement of Adhesion of Direct Copper Plating Layer from HEDP Bath[J];Materials Protection;2007-09
4 ZOU Zhong-li,LI Ning,WANG Dian-long,LI De-yu(Department of Applied Chemistry,Harbin Institute of Technology,Harbin 150001,China);Review of Cyanide-free Alkaline Copper Plating on Steel Matrix[J];Electroplating & Pollution Control;2008-02
5 WANG Rui-xiang Wuhan Fengfan Suface Engineering Co., Ltd, Wuhan 430013, China;Neutral non-cyanide copper plating on steel[J];Electroplating & Finishing;2008-01
6 FENG Shao-bin, HU Fang-hong Henan Provincial Key Laboratory of Surface & Interface Science, Zhengzhou University of Light Industry, Zhengzhou 450002, China;Potential activation phenomenon and non-cyanide direct copper plating[J];Electroplating & Finishing;2008-03
7 XU Jin-lai, DENG Zheng-ping, ZHAO Guo-peng, HU Yao-hong, ZHANG Xiao-ming Guangzhou Etsing Plating Research Institute, Guangzhou 510663, China;Practice of non-cyanide alkaline copper plating process[J];Electroplating & Finishing;2008-03
8 ZOU Zhong-li,LI Ning,LI De-yu Department of Applied Chemistry,Harbin Institute of Technology,Harbin 150001,China;Study of complexing agents for cyanide-free alkaline copper plating on steel substrate[J];Electroplating & Finishing;2008-07
9 GAO Hai-li, ZENG Zhen-ou, ZHAO Guo-peng College of Chemistry & Chemical Engineering, South China University of Technology, Guangzhou 510641, China;Electrochemical behavior of copper plating on copper electrode in HEDP solution[J];Electroplating & Finishing;2008-08
10 HU Li-xin, ZHAN Wen, OUYANG Gui, CHENG Jiao, KOU Zhi-min School of Chemical and Environmental Engineering, Hubei University of Technology, Wuhan 430068, China;Electrochemical methods in the study of copper electrodeposition[J];Electroplating & Finishing;2008-09
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