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《Journal of Materials Protection》 2013-06
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Research Progress of Electroless Silver Plating on Powders

HUANG Qian;HUANG Hui;LAI Yao-bin;GUO Zhong-cheng;Faculty of Metallurgical and Energy Engineering,Kunming University of Science and Technology;Kunming Hengda Technology Company Ltd.,Kunming University of Science and Technology;  
A review was provided of the research progress of electroless silver plating on powders.The mechanism of electroless silver plating was introduced,and the progress in electroless silver plating of metal powders,inorganic non-metallic powders and organic polymer powders in recent years was briefed.Furthermore,the influences of reducing agents,bath temperature,bath pH value,process for preparing bath,and external forces on the dispersibility of the powders and performance of electroless Ag coating were discussed.Moreover,suggestions were also given about existent problems and development trend of electroless silver plating.
【CateGory Index】: TQ153.1
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【Citations】
Chinese Journal Full-text Database 10 Hits
1 HUANG Shao-qiang, QIU Wen-ge, LI Sheng-hua (College of Environmental and Energy Engineering, Beijing University of Technology, Beijing 100022, China);Silver Plating Chemically on Non-metallic Materials[J];Journal of Beijing Polytechnic University;2005-01
2 HUANG Shao-qiang1, QIU Wen-ge1, CHEN Jiang-tao2 (1.College of Environmental and Energy Engineering, Beijing University of Technology, Beijing 100022: 2.No.703 Institute.China Academy of Launch Vehicle Technology, Beijing 100076.China);Effect Factors of Eleetroless Silver Plating on Nonmetallic Powder[J];Materials Protection;2004-10
3 HOU Wei, PAN Gong-pei, GUAN Hua, CHEN Ning (School of Chemical Engineering, Nanjing University of Science & Technology, Nanjing 210094, China).;Electroless Silver Plating on Surface of Carbon Fiber[J];Materials Protection;2007-12
4 CAO Xiao-guo,ZHANG Hai-yan(Faculty of Material and Energy,Guangdong University of Technology,Guangzhou 510006,China);Preparation and Conductibility of Silver-coated Fe_3O_4 Powders[J];Journal of Materials Engineering;2007-04
5 Lu Jianti,Li Zhihua,Cao Ding (Key Laboratory of Nonferrous Metal Materials Science and Engineering of Ministry of Education,Central South University,Changsha 410083,China);Preparation Study of Silver-Coated Glass Fiber by Electroless Plating with Pd-Free Activation[J];Rare Metal Materials and Engineering;2010-S1
6 Pei Fuyu,Chen Jianyong,Zhang Huapeng(Key Laboratory of Advanced Textile Materials and Technology of Preparation,Ministry of Education,Zhejiang Science-Technical University,Hangzhou 310018,China);Study on the Electroless Silver Plating of Talcum Powder[J];Rare Metal Materials and Engineering;2011-03
7 LI Hua-fei,WANG Yan-hui,ZHANG Xi-sheng,LV Ling-bo(Inst.of Equipment and Control of the Chemical Process,Huazhong Univ.of Sci. & Tech.,Wuhan 430074,China);Electroless Silver Plating on Polyurethane Foaming Plastic[J];Electroplating & Pollution Control;2006-03
8 CHEN Bu-ming,GUO Zhong-cheng,YANG Xian-wan Faculty of Materials and Metallurgical Engineering,Kunming University of Science and Technology,Kunming 650093,China;Study progress of electroless silver plating on non-metallic powders[J];Electroplating & Finishing;2006-10
9 ZHANG Zhen-hua, GUO Zhong-cheng, XIAO Hong-liang Faculty of Materials and Metallurgical Engineering, Kunming University of Science and technology, Kunming 650093, China;Study on technics of silver coated aluminum powder[J];Electroplating & Finishing;2007-01
10 CHEN Bu-ming,GUO Zhong-cheng,YANG Xian-wan Faculty of Materials and Metallur-gical Engineering,Kunming University of Science and Technology,Kunming 650093,China;Study on the influence of electroless silver plating on hollow glass microsphere by using surfactants[J];Electroplating & Finishing;2007-02
【Co-citations】
Chinese Journal Full-text Database 10 Hits
1 ;State and Advancement of EMS Materials[J];Safety & EMC;2006-06
2 SUN Hua, FENG Li-ming (Dep. of Materials, Shandong Institute of Architecture and Engineering, Jinan 250014, China);Study of lactic acid electroless system Ni-P alloy complex stabilizers[J];Ordnance Material Science and Engineering;2005-01
3 BI Hu-cai, WEI Ying-hui, HOU Li-feng, YU Chun-yon, HU Lan-qing, YU Bin, XU Bing-she (College of Material Science and Technology, Taiyuan University of Technology, Taijyuan 030024, China);Effect of heat treatment temperatures on characteristic of electroless Ni-P alloy deposits on AZ91D[J];Ordnance Material Science and Engineering;2005-06
4 SONG Hong-feng,LI Zhong-hou(Institute of Surface Engineering Taiyuan University of Technology,Taiyuan 030024,China);Studies on technologies and properties of electroless Ni-P plating on cast iron[J];Ordnance Material Science and Engineering;2006-01
5 CHEN Qi,XIONG Ke,BIAN Kan,JIN Ning,WANG Bangfeng (Aeronautical Science Key Laboratory of Smart Materials & Structures,Nanjing University of Aeronautics and Astronautics, Nanjing 210016,China);Study on the preparation and properties of a new soft actuator[J];Ordnance Material Science and Engineering;2009-02
6 REN Xin,DU Xueyun,CHU Xin(College of Material Science and Engineering,Liaoning Technical University,Fuxin 123000,China);Influence of Ce(SO_4)_2 on the properties of electroless Ni-Cu-P[J];Ordnance Material Science and Engineering;2011-01
7 YE Shuai,WANG Xianhui,ZOU Juntao,LIANG Shuhua (School of Materials Science and Technology,Xi′an University of Technology,Xi′an 710048,China);Electroless silver plating of TiB_2 powders[J];Ordnance Material Science and Engineering;2012-01
8 REN Xin,ZHANG Ruoyu,DU Xueyun,GU Yongxu(College of Material Science and Engineering,Liaoning Technical University,Fuxin 123000,China);Performance comparison between electroless Ni-Ce-P and Ni-Cu-Ce-P on 27SiMn steel[J];Ordnance Material Science and Engineering;2012-02
9 MENG Xuan-hua, LIN Jing, ZONG Xiang-fu(Department of Material Science, Fudan University, Shanghai 200433, China);Wafer bumping by electroless nickel and stencil printing[J];Semiconductor Technology;2002-03
10 CHEN Yi-fang1a,YUAN Cheng-chao1a,JIANG Hua2,ZHANG Yuan-ming1a,CHEN Yun-fei1b(1a.Department of Mechanical Engineering;b.National Key Laboratory of MEMS,Southeast University, Nanjing 210096,China;2.Center for Integrated Engineering,Southeast University,Nanjing 210088,China);Laser-Induced Selective Electroless Plating of Copper on Semiconductor Silicon[J];Micronanoelectronic Technology;2006-03
China Proceedings of conference Full-text Database 10 Hits
1 Niu Zhen-jianga,Wang Fei-huaa,Yu Pinga,Li Ze-lina,Du Xiao-guangb a.Institute of Physical Chemistry,Zhejiang Normal University,Jinhua 321004,Zhejiang b.Qingtian Branch School of Zhejiang Radio &Television Universiti,Qingtian 323900,Zhejiang;Electrochemical Investigation on the Corrosion Resistance of Electroless Ni-P Alloys[A];[C];2004
2 Dong Guo,Zhongdong Yang,Zhanguo Fan (School of Materials and Metallurgy,Northeastern University,Shenyang 110004,China);Electroless Plating of Ni - P Coatings on Surface Metallization for Magnesium Alloys[A];[C];2007
3 Gao Rong-jie1,Du Min2(1.Institute of Materials Science and Engineering,Ocean Univ.of China,Qingdao 266100,China 2.College of Chemistry and Chemical Engineering,Ocean Univ.of China,Qingdao 266100);Corrosion Resistance of Double Electroless Ni-P Deposits of Sealing-Treatment[A];[C];2010
4 LIU Yan-kun, FENG Yu-jie, GAO Pei-yuan, WU Xiao-wei (School of Municipal & Environmental Engineering, Harbin Institute of Technology, Harbin 150090, China);Research on the electroless silver plating on the surface of carbon fibers[A];[C];2006
5 YU Liu-fang, ZHU Hong, LIN Hai-yan, GUO Hong-fan (School of Science, Beijing Jiaotong University, Beijing 100044, China);Study on the microwave absorbing property of carbon nanotubes with Co coating[A];[C];2006
6 ZHANG Ji-qiao YANG Yu-guo ZHU Hong GUO Hong-fan (School of Science,Beijing Jiaotong University,Beijing 100044,China);A study on preparation and electromagnetic properties analysis of metal modofied carbon fiber/PET composites[A];[C];2007
7 Geng Qiu-ju Zhou Rong-ming Yin Ren-he Yu Zu-zhan He Yan-feng Sun Jang-yan (1.Department of Chemistry,College of Sciences,Shanghai Univ.,Shanghai 200436,China;2.Department of Chemistry,Fudan Univ.,Shanghai 200433,China 3.Sinyang Electronics Chemicals Co.,LTD.,Shanghai 201803);Research on Extending Life of Electroless Nickel Solution[A];[C];2005
8 GUO Chang-chun~1 CHENG Dan-hong~2 LI Ke-jun~3 ZHANG Qing~1 GUO Guo-cai~4 CAO Tie-hua~1 (1. Environment and Chemical Engineering College Shanghai University, Shanghai 200072, China; 2. China Executive Leadership Academy Pudong, Shanghai 201204,China; 3. Shanghai DM Chemical Technology Co., Ltd; Shanghai 200072,China; 4. Shanghai Institute of Technology, Shanghai 200235, China);Direct Electroless Nikel Plating Process on AZ91D Magnesium Alloy[A];[C];2006
9 Song renjun Zhao yongwu;Effect of complexing agent on electroless nickel plating[A];[C];2007
10 GUO Zhongcheng,CHANG Shiying,Huang Feng,Xie Xiangsheng (Faculty of Materials and Metallurgical Engineering,Kunming University of Science and Technology,Kunming,650093 Kunming Hendera Science and Technology Co.LTD,Kunming,650106);Studies on Structure and Mechanism of Silver Coated Aluminium Powder for Electromagenic Shield[A];[C];2009
【Secondary Citations】
Chinese Journal Full-text Database 10 Hits
1 MAO Qian-jin, YU Cai-xia, WANG Qun, ZHANG Feng, GE Kai-yong, ZHOU Mei-ling ( College of Material Seienee and Engineering, Beijing University of Technology, Beijing 100022, China );Electroless Metal Plating of Cenosphere and Its Electromagnetic Shielding Properties[J];Journal of Beijing Polytechnic University;2003-01
2 HUANG Shao-qiang, QIU Wen-ge, LI Sheng-hua (College of Environmental and Energy Engineering, Beijing University of Technology, Beijing 100022, China);Silver Plating Chemically on Non-metallic Materials[J];Journal of Beijing Polytechnic University;2005-01
3 Guan Changbin, Sun Lijun;The Effect of Electroless Plated Cu on Properties of Diamond[J];Surface Technology;1995-05
4 LING Guo-ping (Institute of Metallic Materials, Zhejiang University, Hangzhou 310027, China);Influencing Factors on the Uniformity of Electroless Nickel Plating on Cenospheres[J];Surface Technology;2004-04
5 HE Yi-yan~1, ZHAO Qiang~2, DU Shi-guo~1, SHI Dong-mei~1 (1. Department 3, Ordnance Engineering College, Shijiazhuang 050003, China; 2. Factory 451, Military Delegate Agency in Chongqing, Chongqing 400032, China);Advances on Anti-oxidation Technology of Copper Powder[J];Surface Technology;2004-06
6 ZHENG Heng,SHAO Qian,LENG Shu-wei,GE Sheng-shong (School of Chemistry and Environment Engineering,Shandong University of Science and Technology,Qingdao 266510,China);Palladium-free Activation Electroless Nickel Plating on Cenosphere Surface[J];Surface Technology;2008-01
7 LIU Bo-wei,ZHANG Jin-sheng,FAN Yi et al(State Key Laboratory for Powde Metallurgy,Central South University of Technology,Changsha,P.R.China 410083).;Electroless Copper Plating of Non-Metallic Particles and Its Effects on Strength of Sintered Friction Materials[J];Materiais Protection;2001-02
8 ZHAO Wen,ZHANG Qiu-yu,YUAN Ding-zhong,et al(Depayment of Chemical Engineering,Northwest Polytechnical University,Xián 710072,China).;Pretreatment Process for Electroless Nickel Plating of Hollow Glass Microspheres[J];Materials Protection;2004-03
9 ZENG Ai- xiang~(1,2), XIONG Wei-hao~1, XU Jian~1 , ZHAO Rui-yun~2 (1. State Key Laboratory of Die & Mould Technology, Huazhong University of Science and Technology, Wuhan 430074 ; 2. Department of Chemistry, Changsha University of Science and Technology, Changsha 410077, China);Electroless Ni-Co-P Plating on Fly Ash Cenosphere[J];Materials Protection;2004-04
10 HUANG Shao-qiang1, QIU Wen-ge1, CHEN Jiang-tao2 (1.College of Environmental and Energy Engineering, Beijing University of Technology, Beijing 100022: 2.No.703 Institute.China Academy of Launch Vehicle Technology, Beijing 100076.China);Effect Factors of Eleetroless Silver Plating on Nonmetallic Powder[J];Materials Protection;2004-10
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