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《Materials Review》 2000-09
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Current Status of Research on Electronic Packaging Materials

Huang Qiang Gu Mingyuan Jin Yanping(State Key Lab. of Metal Matrix Composite, Shanghai Jiaotong University .Shanghai 200030 China)  
The rapid development of electronic and packaging technology has led to active search for newermaterials. This paper presents a review of the advancesm the development of the latest packaging materials Emphasisis placed on Metal Matrix Composite .and various factors which influence the thermal properties of materials including reinforcement .matrix .processing method and microstructure are discussed. Future trends and ways to improve properties are put forward accordingly.
【CateGory Index】: TN405
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【References】
Chinese Journal Full-text Database 10 Hits
1 ZHANG Jian-yun, WANG Lei, ZHOU Xian-liang, HUA Xiao-zhen (Department of Material Engineering, Nanchang Institute of Aeronautical Technology, Nanchang 330034, China);Thermophysical properties of high volume fraction SiC_p/Al composite[J];Ordnance Material Science and Engineering;2006-03
2 WANG Jia jun 1,YI Xiao su 2 (1.Zhejiang Institute of Science and Technology, Hangzhou 310033, China; 2.Beijing Institute of Aeronautical Materials, Beijing 100095, China);Thermal Conductive High Performance Polymer Microelectronic Packaging Material(Ⅰ):Preparation of the Packaging Material[J];Packaging Engineering;2003-03
3 WANG Jia-jun, Yi Xiao-su(1. Zhejiang Institute of Science and Technology, Hangzhou 310033, China;2. Beijing Institute of Aeronautical Materials, Beijing 100095, China);Thermal Conductive High Performance Polymer Microelectronic Packaging Material Ⅱ Thermal Conductivity and Thermal Expansion of the Packaging Material[J];Packaging Engineering;2003-04
4 TIAN Bin, HU Ming(Sch of Elct Info Engin,Tianjin University,Tianjin 300072,China);Development and trends of MEMS packaging technology[J];Journal of Transducer Technology;2003-05
5 HU Xue-mei,LJun-xia(Department of Electrical Engineering,Henan Polytechnic Institute,Nanyang 473009,China);MEMS packaging technology[J];Transducer and Microsystem Technologies;2006-12
6 HUANG Qiang JIN Yanping GU Mingyuan (State Key Lab, of Metal Matrix Composites,Shanghai Jlaotong University ,Shanghai 200030);Processing Routes of Metal Matrix Composite for Electronic Packaging[J];Materials Review;2002-09
7 LIN Feng~1, FENG Xi~2, LI Shichen~2, REN Xianjing~1, JIA Xianshang~1(1 Beijing General Research Institute of Mining and Metallurgy, Beijing 100044; 2 Institute of Material Science and Engineering,Central South University, Changsha 410083);Research on High Performance Novel Electronic Packaging Materials of Silicon-based Aluminum[J];Materials Review;2006-03
8 GAN Weiping,LIU Hong, YANG Fuliang(School of Materials Science and Engineering,Central South University, Changsha 410083);Microstructures and Mechanical Properties of High Silicon Aluminum Alloy Effected by Different Process[J];Materials Review;2006-03
9 ZHONG Gu, WU Shusen, WAN Li(State Key Lab of Material Processing and Die & Mold Technology, Huazhong University of Science and Technology, Wuhan 430074);Research Development of Electronic Packaging Materials with High SiCp or Si Content[J];Materials Review;2008-02
10 TANG Tao, ZHANG Qi-tu, XU Zhong-zi (College of Materials Science and Engineering, Nanjing University of Technology, Nanjing 210009, China);Preparation and Properties of Glass-silica Composite Substrate[J];Electronic Components and Materials;2006-09
【Citations】
Chinese Journal Full-text Database 2 Hits
1 Li Xiuqing (Hebei Semiconductor Research Institute,Shijiazhuang 050051);High Density 3D Packaging Technology[J];SEMICONDUCTOR INFORMATION;1998-06
2 Shen Dejiu Qiao Guiying Wang Yulin Yuan Hui Fang Chunlin(Yanshan University, Qinhuangdao 066004) (*The First Heavy Machine Factory, Qiqihaer 164000)Zheng Qiguang Gu Jianhui Wang Tao Tao Xingzhi(Huazhong University of Technology, Wuha;LASER REMELTING OF A PULSE DISCHARGE COATING ON 50CrMoV STEEL[J];ACTA MATERIAE COMPOSITAE SINICA;1997-04
【Co-citations】
Chinese Journal Full-text Database 10 Hits
1 JING Yu-an1,WANG Chen-yu2(School of Materials Science and Engineering,University of Science and Technology Liaoning,Anshan 114051,China;2.Anshan High & Advanced Technology Development Zone,Anshan 114044,China);Manufacturing technology for clad plate of stainless steel[J];Journal of Anshan University of Science and Technology;2007-06
2 He Yanlin,Li Jianpin;IMPACT FRACTURE BEHAVIOR OF SIC_p/A359 COMPOSITES[J];ORDNANCE MATERIAL SCIENCE AND ENGINEERING;1999-06
3 SUN Wei (College of Electromechanical Engineering and Automation, National University of Defence Technology, Changsha 410073, China);Finite Element Simulation of Frequency Response Characteristic for Power Electronic Component[J];Ordnance Industry Automation;2004-01
4 YE Fei,MA Ming-xing (School of Mechanical Engineering,Yangzhou University,Yangzhou 225009,China);Design and Development of Electronic Accelerator Pedal Circuits Based on Hall Sensor[J];Journal of Chongqing Institute of Technology(Natural Science);2008-11
5 Xiong Xingguo Lu Deren Lu Ping fang Xiong Bin Wang Weiyuan (State Key. Lab. of Transducer Technology, Shanghai Institute of Metallurgy, Chinese Academy of Science);Measurement of Small Load and Displacement Using Balance[J];Journal of Transcluction Technology;1997-02
6 ZHOU Dong yue, HUANG Zhao hong, JIANG Shao qing, KUANG Zhi feng, TAN Yan zhi (Inst of Quantum Electronics,South China Normal University,Guangzhou 510631,China);Application of semiconductor magnetic head in money detector[J];Journal of Transducer Technology;2002-03
7 WANG Rui1, HUANG Zhao-hong 1, LI Min-yi2 (1.South China Inst of Quantum Elct,South China Normal University,Guangzhou 510631,China; 2.Guangdong Institute of Metrology,Guangzhou 510405,China);Design of new-style InSb-In film magnetoresistive vibration pickup[J];Journal of Transducer Technology;2005-07
8 LIU Bing,HUANG Zhao-hong,KONG Ling-tao(Laboratory of Photonic Information Technology,School of Information and Photoelectric Science and Engineering,South China Normal University,Guangzhou 510006,China);Design of temperature switch based on InSb-In magnetoresistor[J];Transducer and Microsystem Technologies;2009-01
9 ;InSb Film Magnetoresistive Vibration Sensor[J];Sensor World;2003-11
10 ;The Insb Magnetorsistive Gear Velocity Sensor With Bigger Current[J];Sensor World;2003-11
【Co-references】
Chinese Journal Full-text Database 10 Hits
1 Chen Keqiao; Zhang Shuhong; Zhang Daiming; Li Shiyun and Li Jianyun(Kunming University of Science and Technology, Kunming 650093 );Studing Advance and New Techniques Review of Metal Composites[J];SICHUAN NONFERROUS METALS;2000-02
2 Niu Mutong, Wu Weiduan, Guo Shengping (College of Material Science and Engineering, Huaqiao University, Quanzhou 362011, China);STUDY ON PROPERTIES OF EPOXY RESIN/SHORT CARBON FIBER/SERICITE COMPOSITE[J];Engineering Plastics Application;2006-01
3 LI Yong,WANG Yu-lian,QIN Yan-fu,LI Qian,GUANG Bang-gui,LV Yue-feng(College of Sciences,Anhui Science and Technology University,Fengyang 233100,China);Study on Method of Removing Iron from Silica Sand[J];Journal of Anhui Science and Technology University;2008-02
4 Chen Shujiang(Dept.of chemical Engineering);The Productive Method and Apply of the Super Fine Powder[J];JOURNAL OF ANSHAN INSTITUTE OF IRON AND STEEL TECHNOLOGY;1994-02
5 Liu Zhengchun, Wang Zhifa, Jiang Guosheng;ADVANCES IN METAL-MATRIX MATERIAL FOR ELECTRONIC PACKAGING[J];Ordnance Material Science and Engineering;2001-02
6 Yang Dixin;TECHNOLOGY STUDY OF PREPARING METAL MATRIX COMPOSITES BY SELF-INFILTRATING[J];Ordnance Material Science and Engineering;2001-04
7 YUAN Qin-lu 1, HU Rui 2, LI Jin-shan 2, L Zhen-lin 1 (1. School of Materials Science and Engineering, Xi'an University of Technology, Xi'an 710048,China; 2. State Key Laboratory of Solidification Processing, Northwest Polytechnic University, Xi'an 710072,China);Progress in manufacturing technology of functionally graded materials[J];Ordnance Material Science and Engineering;2003-06
8 ZOU Jia-sheng, XU Ru-qiang, ZHAO Qi-zhang (Department of Welding Technology and Engineering East China Shipbuilding Institute, Zhenjiang Jiangsu 212003, China);Study on wettability on aluminum matrix composites with aluminum base filler metals[J];Ordnance Material Science and Engineering;2004-02
9 DING Jian, ZHAO Niao-qian, SHI Chun-sheng, HE Chun-nian (College of Material Science and Engineering, Tianjin University, Tianjin 300072, China);Research on preparation technology of nano-reinforced copper matrix composites[J];Ordnance Material Science and Engineering;2005-05
10 ZHAO Guo-tian1,SUN Shu-jie1,XU Yong-dong1,ZHU Xiu-rong1,CHEN Zhao-feng2(1.Ningbo Branch of China Academy of Ordnance Science,Ningbo 315103,China;2.College of Material Science and Technology,Nanjing University of Aeronautics &Astronautics,Nanjing 210016,China);High volume aluminum matrix composites prepared by pressureless infiltration[J];Ordnance Material Science and Engineering;2006-02
【Secondary References】
Chinese Journal Full-text Database 10 Hits
1 Lin Xiaodan,Zeng Xingrong(College of Material Science,South China University of Technology, Guangzhou 510640,China)Zhang Jinzhu,Zhang Zhenxiang,Xu Yingbin(Guangzhou Huadu Keyuan Enterprises Co.Ltd.,Guangzhou 510860,China);PREPARATION AND PROPERTIES OF INSULATING THERMAL CONDUCTIVE PA66[J];Engineering Plastics Application;2006-04
2 ZHANG Jian-yun, WANG Lei, ZHOU Xian-liang, HUA Xiao-zhen (Department of Material Engineering, Nanchang Institute of Aeronautical Technology, Nanchang 330034, China);Thermophysical properties of high volume fraction SiC_p/Al composite[J];Ordnance Material Science and Engineering;2006-03
3 YAN Xue-ping, CHENG Li, HAN Qing-fu, ZHANG Hui, LI Jun, LIU De-lin, XU Zhi-chun (Institute of Electricity and Information, Jiangsu University, Zhenjiang 212013, China);Package Materials and Processes of MEMS Devices[J];Semiconductor Technology;2006-12
4 WANG Jia-jun, Yi Xiao-su(1. Zhejiang Institute of Science and Technology, Hangzhou 310033, China;2. Beijing Institute of Aeronautical Materials, Beijing 100095, China);Thermal Conductive High Performance Polymer Microelectronic Packaging Material Ⅱ Thermal Conductivity and Thermal Expansion of the Packaging Material[J];Packaging Engineering;2003-04
5 HU Xue-mei,LJun-xia(Department of Electrical Engineering,Henan Polytechnic Institute,Nanyang 473009,China);MEMS packaging technology[J];Transducer and Microsystem Technologies;2006-12
6 LIN Feng~1, FENG Xi~2, LI Shichen~2, REN Xianjing~1, JIA Xianshang~1(1 Beijing General Research Institute of Mining and Metallurgy, Beijing 100044; 2 Institute of Material Science and Engineering,Central South University, Changsha 410083);Research on High Performance Novel Electronic Packaging Materials of Silicon-based Aluminum[J];Materials Review;2006-03
7 GAN Weiping,LIU Hong, YANG Fuliang(School of Materials Science and Engineering,Central South University, Changsha 410083);Microstructures and Mechanical Properties of High Silicon Aluminum Alloy Effected by Different Process[J];Materials Review;2006-03
8 ZHANG Wei,YANG Fuliang,GAN Weiping,LIU Hong(School of Material Science and Engineering,Central South University,Changsha 410083);Study on Thermal Expansion Property of High-silicon Aluminum Alloy for Electronic Packaging[J];Materials Review;2006-S1
9 YANG Yongsen YANG Juan CHENG Xiaonong (School of Materials Science and Engineering,Jiangsu University,Zhenjiang 212013);Research Progress in the Preparation and Application of Polyimide Composite Films with Low Thermal Expansion Coefficient[J];Materials Review;2007-S3
10 ZHONG Gu, WU Shusen, WAN Li(State Key Lab of Material Processing and Die & Mold Technology, Huazhong University of Science and Technology, Wuhan 430074);Research Development of Electronic Packaging Materials with High SiCp or Si Content[J];Materials Review;2008-02
【Secondary Citations】
Chinese Journal Full-text Database 3 Hits
1 Zhang Song;Kang Yuping;Zhu Jingpu (Shenyang Polytechnic University,Shenyang 110021)Tan Chaoxin(Shenyang Air-Blower Factory,Shenyang 110026)Zhang Chunhua(Shenyang Tractor Plant,Shenyang 110023);Application of Laser Cladding to Air-blower Vane[J];CHINESE JOURNAL OF LASERS;1995-05
2 XU Yourong;ZHANG Henghua;CHEN Daming;XIE Fuchun;XU Mingyu;CHEN Lanying;SU Baorong;QIAN Hongbin Shanghai University of Science and Technology Shanghai Optics and Fine Mechinery Research Institute, Academia Sinica professor,Department of Materials Science and Engineering,Shanghai University of Science and Technology, Shanghai 201800;EFFECT OF LASER SCANNING SPEED ON PHASE CONSTITUTION AND WEAR RESISTANCE OF LASERCLADDING STELLITE HARD FACING ALLOY[J];Acta Metallurgica Sinica;1993-03
3 AN Shimin; MEI Yu(Dalian University of Technology, Dalian 116023);MICROSTRUCTURE OF LASER CLADDING TiC/(Ni+Cr) COMPOSITE POWDERS[J];ACTA METALLRUGICA SINICA;1996-04
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