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《Materials Review》 2007-S1
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Characteristics ,Preparation and Research Advance of W-Cu Composite Material for Electronic Packaging

SHI Nailiang, CHEN Wenge(School of Materials Science and Engineering,Xi’an University of Technology, Xi’an 710048)  
The development of micro-electronic industry has led to strict claim for the properties of electronic packaging material. According to the new development of packaging material, the demand of characteristics and preparation technology of W/Cu composite material for electronic packaging are expounded in this thesis. And the tendency to develop W/Cu composite material on electronic packaging is reviewed.
【Fund】: 陕西省自然科学基金资助(2004E105)
【CateGory Index】: TB332
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