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《Materials Review》 2008-02
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Research Development of Electronic Packaging Materials with High SiCp or Si Content

ZHONG Gu, WU Shusen, WAN Li(State Key Lab of Material Processing and Die & Mold Technology, Huazhong University of Science and Technology, Wuhan 430074)  
High volume fraction SiCp reinforced aluminum matrix composites and high Si content Al-Si alloy become the ideal candidates for electronic packaging materials due to their superior properties such as high thermal conductivity, tailorable coefficient of thermal expansion as well as low density. Combined with the research results of the authors, the fabrication technologies and present application situation of these materials are introduced in detail. The drawbacks of the technologies used in scale industry production are pointed out, and the directions for the future research and development are suggested additionally.
【CateGory Index】: TB333
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