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《Rare Metal Materials and Engineering》 2007-S3
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Studies on Diffusion Dissolve Layer of Cu and Sn Powder Phase Interface

Song Yuqiang Li Shichun (College of Mechanical and Electronic Engineering,China University of Petroleum,Dongying 257061,China)  
The Cu/Sn diffusion dissolve layer of powder interfaces was formed using the technology of powder sinter.The feature of diffusion dissolve layer was observed by optics and electron microscope,the phase of layer was analysed by AES and X-ray diffraction. The structure of diffusion dissolve layer was discussed with Thomas-Fermi-Dirac-Cheng(TFDC)model.The results show that Sn atoms could diffuse continuously into Cu particles,Cu_6Sn_5,Cu_(81)Sn_(22),Cu_(39)Sn_(11)and Cu_(327.92)Sn_(88.08)diffusion dissolve layer was formed early or late and one by one on the interface of Cu powder and Sn powder during sintering on given sinter condition(200℃,10h).Moreover,the four intermetallic compounds possess corresponding thickness.The structure of diffusion dissolve layer is Cu phase,Cu/Cu_(327.92)Sn_(88.08) interface,Cu_(327.92)Sn_(88.08)phase,Cu_(327.92)Sn_(88.08)/Cu_(39)Sn_(11)interface,Cu_(39)Sn_(11)phase,Cu_(39)Sn_(11)/Cu_(81)Sn_(22)interface,Cu_(81)Sn_(22)phase, Cu_(81)Sn_(22)/Cu_6Sn_5,Cu_6Sn_5 phase and Cu_6Sn_5/Sn interface.In addition,the four intermetallic compounds distribute with state of"layer".
【Fund】： 国家自然科学基金(50371059)
【CateGory Index】： TB302
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