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《Journal of Changzhou Vocational College of Information Technology》 2005-02
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On Improving the Quality of SMT Soldering

SHI Hong-wei(Dept. of Electronic and Information Engineering, Jiangyin Polytechnic College, Jiangyin 214433, China)  
Soldering techniques is one part of SMT. Its quality will affect soldering quality and the cost of product. Therefore, it is important to improve soldering quality and reduce soldering defects and the cost of product. There are many elements to affect the quality of SMT soldering. This article analyses three familiar soldering defects such as solder balls, short circuit, manhattans etc in printed circuit assembly that utilizes surface mount technology (SMT) and puts forward some valid measures to eliminate these defects.
【CateGory Index】: TG457
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【Citations】
Chinese Journal Full-text Database 3 Hits
1 SUN Hong-ri,LIN Guo-hui (Jishiyu Fine Chemical Company Limited Xiamen,Fujian 361006,China);Wave Soldering Common Question And Solution Countermeasure[J];ELECTRONICS PROCESS TECHNOLOGY;1999-05
2 LU Jia (Institute of Engineering of China Academy of Engineering Physics,Chengdu 621900,China);Several SMT Soldering Defects and Measures to Solve Them[J];ELECTRONICS PROCESS TECHNOLOGY;2000-05
3 WANG Jin-zhi(CETC No.2 Research Institute,Taiyuan030024,China);The causes and solutions of common defects during reflow[J];Electronics Process Technology;2003-04
【Co-citations】
Chinese Journal Full-text Database 10 Hits
1 REN Bin~(1,2) CHENG Liang-lun~1 (1.College of Automation,Guangdong University of Technology,Guangzhou 510006,China; 2.College of Electronic Engineering,Dongguan University of Technology,Dongguan 523808,China);Key Techniques of AOI for PCB SMT Assembly Products[J];Journal of Dongguan University of Technology;2009-01
2 HU Qiang1,LI Zhong-suo1,ZHAO Zhi-li2,LI Da-le2 (1.Lead-free soldering R&D Center of Sun East Electronic Co.Ltd,Shenzhen518103,China;2.Harbin Institute of Technology,Harbin150001,China);Causes and Countermeasure of Bridge Phenomenon in Wave Soldering[J];Equipment For Electronic Products Manufacturing;2004-11
3 SHI Jian-wei1.2,HE peng1, QIAN Yi-yu1, YUAN He-ping2 (1.Harbin Institute of Technology, Harbin 150001, China; 2.Sun East Electronic technology (ShenZhen) company Lt.d, Shenzhen 518103, China);Press Technology of Solder Paste and Change of Process Parameter in Lead-free Technology[J];Equipment for Electronic Products Manufacturing;2006-12
4 SHI Jian-wei,LIANG Yong-jun,WANG Hong-ping ( Sun East Electronic Technology (Shen Zhen) Company Ltd.,518103 );Nitrogen Protection's Effect on Solder Joint Appearance in Lead-free Reflow Soldering[J];Equipment for Electronic Products Manufacturing;2007-10
5 ZHU Gui-bing (SMT laboratory of Nanjing College of Information Job Technology,Nanjing 210046,China);Analyzing the defect of SMT manufacturing process for electronic product[J];Equipment for Electronic Products Manufacturing;2008-09
6 ZHANG Ru-ming (No.43 Electronics Research Institute, China Ministry of Information Industry, Hefei Anhui 230022);The Importance of Service System for SMT Industry[J];Electronic Components $ Materials;2002-05
7 WANG Jin-zhi(CETC No.2 Research Institute,Taiyuan030024,China);The causes and solutions of common defects during reflow[J];Electronics Process Technology;2003-04
8 YANG Hong-zhen,CAO Xin-yu,ZHAO Xiao-qin (North China Institute Of Aerospace Engineering,Langfang 065000,China);Analysis and Control of Golden Finger Contamination[J];Electronics Process Technology;2007-06
9 XIE Yang-min,SHI Hang,LIU Qiang (School of Mechanical Engineering and Automation, Beijing University of Aeronautics and Astronautics, Beijing 100083, China);Research and Design of the Vision Positioning System of High-Precision Surface Mounting Machine[J];Equipment Manufacturing Technology;2007-12
10 YANG Hong-zhen CAO Xin-yu(Electronics Engineering Department,North China Institute of Aerospace Engineering 065000);The Prevention of Pollution in the SMT Process of Gold PCB Board[J];Journal of North China Institute of Aerospace Engineering;2007-06
【Co-references】
Chinese Journal Full-text Database 7 Hits
1 Zhang Yumin Beijing Vocational & Technical Institute of Industry, Beijing 100042,China;The Analysis of Some Commen Problems in SMT with Soldering Paste[J];Journal of Beijing Vocational & Technical Institute of Industry;2005-04
2 Xian Fei (Fiberhome Telecommunication Technologies Co.,Ltd, Wuhan 430074,China);The Factors of Infecting of Quality In Solder-Paste Printing Process[J];Equipment For Electronic Products Manufacturing;2002-03
3 LIU Cheng-wen,SONG Zhen-yu(Acheng Relay Limited Company,Acheng150302,China);Paste and Paste Print in SMT[J];Electronics Process Technology;2003-04
4 HUANG Bing-yuan, HAN Guo-ming, FAN Qiang,MAO Xin-long(Tianjin University,Tianjin300072,China) ;Research Status of Reflow Soldering Process in SMT[J];Electronics Process Technology;2004-06
5 WANG Wen-bo~1,SHI Xing-yao~2(1.CAMA Electronics Co. Ltd,Luoyang471000,China;2.Hebi Radio & Television Bureau,Hebi456650,China);Process and Analysis of SMT Production[J];Electronics Process Technology;2005-04
6 YUAN Kang-min(Mechanical and Electrical Engineering Department of NIT,NanChang 330029,China);Research on Relative Problems in SMT Production[J];Electronics Process Technology;2006-01
7 Chen Shou-cai Tao Yan-yan (Hunan Vocational College of Commerce, Changsha 410205, China);Quality and Reliability in SMT Production[J];Electronics Quality;2006-05
【Secondary Citations】
Chinese Journal Full-text Database 2 Hits
1 LU Jia (Institute of Engineering of China Academy of Engineering Physics,Chengdu 621900,China);Several SMT Soldering Defects and Measures to Solve Them[J];ELECTRONICS PROCESS TECHNOLOGY;2000-05
2 ;Several Famaliar SMT Soldering Defects and Measures to Solve Them[J];Electronics Quality;2001-02
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