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《Electroplating & Finishing》 2004-01
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Electroless silver plating for glass microsphere

HUANG Shao-qiang, QIU Wen-ge (College of Environment and Energy Engineering, Beijing University of Technology, Beijing 100022, China)  
Effects of different reducing agents on the compactibility of plating layer and conductivity of products were discussed in electroless Ag plating for glass microsphere. The properties of Ag deposit were also determined. The results show that both the uniformity and adhesion of Ag deposit were improved using compound of glucose and potassium tartrate as reducing agent. Ag electroless deposited glass microsphere can be possibly used as conductive filler of high conductive polymer materials.
【Fund】: 北京市自然科学基金资助项目(2032002)
【CateGory Index】: TQ153
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