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《Electroplating & Finishing》 2013-07
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Preparation of circuit pattern for printed circuit board by silver ink printing and electroless copper plating

LIU Zheng-kai, ZHENG Hai-bin, WANG Peng-ling, HUANG Shao-luan, CHEN Huan-wen, YUAN Yuan-yuan, GONG Xiao-zhong* College of Materials Science and Engineering, Shenzhen University, Shenzhen 518060, China  
Printed circuit board was prepared by printing circuit pattern on polyimide substrate with conductive nano-silver ink using common printer followed by electroless copper plating. The effect of electroless copper plating time on the deposition rate were studied, and the effect of curing temperature of conductive silver ink on the properties of copper coating, such as wear resistance, adhesion strength, thickness, and resistivity, were studied. The deposition rate of electroless copper plating is maximum (13.58 μm/h) when plating time is 40 min. The suitable curing temperature of conductive silver ink is 300 ℃, and the copper coating obtained thereafter has minimum resistivity, best wear resistance, and highest adhesion strength.
【Fund】: 广东省科技计划项目(2009B011000014)
【CateGory Index】: TQ153.14
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