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《EQUIPMENT FOR ELECTRONIC PRODUCTS MANUFACTURING》 2000-02
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The Present Situation of High-Density Packaging and Its Future

TONG Zhi?yi (The 45th Institute of Electronic,Ministry of II,Pingling Gansu 744000;China)[FK(W62。36ZQ]  
The present situation of microelectronic packaging technology that have deeply influence on development of semiconductor IC is described.Also the key technologies such as TCP、BGA、FC、CSP、MCM、3D packaging etc.Which are used for high-density packaging and its future is pointed out.
【CateGory Index】: TN305
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【References】
Chinese Journal Full-text Database 2 Hits
1 Ding Liguang(Institute of Machinery,Guangxi Institute of Technology,Liuzhou 545006,China)Ding Wei(Chongqing Jinying NC Equipment Manufacturing Co.Ltd.,Chongqing 401120,China);RESEARCH ON PREVENTING THE INTERNAL STRESS OF RESIN IN ELECTRONIC ENCAPSULATION[J];Engineering Plastics Application;2005-08
2 YANG Hui-juan,WANG zhi-fa,JIANG Guo-sheng,WANG Hai-shan,TANG Ren-zheng(School of Materials Science and Engineering,Central South University,Changsha 410083,China);Preparation of Kovar/Cu/Kovar Laminates by Rolling Combination[J];Rare Metals and Cemented Carbides;2004-02
【Co-references】
Chinese Journal Full-text Database 10 Hits
1 Liu Zhengchun, Wang Zhifa, Jiang Guosheng;ADVANCES IN METAL-MATRIX MATERIAL FOR ELECTRONIC PACKAGING[J];Ordnance Material Science and Engineering;2001-02
2 YUAN Qin-lu 1, HU Rui 2, LI Jin-shan 2, L Zhen-lin 1 (1. School of Materials Science and Engineering, Xi'an University of Technology, Xi'an 710048,China; 2. State Key Laboratory of Solidification Processing, Northwest Polytechnic University, Xi'an 710072,China);Progress in manufacturing technology of functionally graded materials[J];Ordnance Material Science and Engineering;2003-06
3 Li Mei (Beijing Information Institute of Science technology, Beijing 100009);Develepment and the Prospect of Microelectronics Packaging Technology[J];SEMICONDUCTOR TECHNOLOGY;2000-05
4 SHI Chang-hong,WANG Jin-song(Graduate School at Shenzhen,Tsinghua University, Shenzhen,518057 China);Key technologies of high speed and high precision motion systemfor microelectronic manufacture[J];Semiconductor Technology;2003-03
5 LONG Zhi-li,HAN Lei,WU Yun-xin,ZHOU Hong-quan (College of the Electromechanical Engineering, Central South University, Changsha 410083,China);Study of the Effect of Temperature Factor on Thermosonic Bonding Strength[J];Semiconductor Technology;2005-06
6 QU Xin1, LOU Hao-huan1, CHEN Zhao-yi1, QI Bo1, LEE Taekoo2, WANG Jia-ji1 (1.Fudan-Samsung Packaging Reliability Joint Lab, Department of Material Science, Fudan University, Shanghai 200433, China; 2. SAMSUNG Semiconductor China R&D Co., Ltd., Suzhou 215021, China);Fatigue Life Assessment of Solder Joints of BGA Component in Board Level Drop Test[J];Semiconductor Technology;2006-06
7 GUANG Ming-an,HAN Lei (School of Machanical and Elecrtronic Engineering, Central South University, Changsha, 410083, China);Experimental Study on the Bonding Force Characteristics in Ultrasonic Bonding Process[J];Semiconductor Technology;2006-08
8 Chen Ying,Kang Rui (Institute of Reliability Engineering,Beihang University,Beijing 100083,China);Study on Lifetime Impact Factors of Solder Joint in PBGA Packaging[J];Semiconductor Technology;2008-07
9 Li Xiuqing,Ge Xinxia (The 13th Electronic Research Institute,Shijiazhuang 050051);Study on the Ball Grid Array Packaging[J];SEMICONDUCTOR INFORMATION;2000-04
10 GAO Shang-tong (Hebei Semiconductor Research Institute,Shijiazhuang 050051,China);Microelectronics packaging marching towards the new century[J];Semiconductor Information;2000-06
【Secondary References】
Chinese Journal Full-text Database 1 Hits
1 ZHANG Liang1,XUE Song-bai1,YU Sheng-lin1,2,HAN Zong-jie1,GAO Li-li1,LU Fang-yan1,SHENG Zhong1 (1.College of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China;2.The 14th Research Institute,China Electronics Technology Group Corporation,Nanjing 210013,China);Application of FEM analysis in reliability of micro-soldered joints[J];Electric Welding Machine;2008-09
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