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The Present Situation of High-Density Packaging and Its Future

TONG Zhi?yi (The 45th Institute of Electronic,Ministry of II,Pingling Gansu 744000;China)[FK(W62。36ZQ]  
The present situation of microelectronic packaging technology that have deeply influence on development of semiconductor IC is described.Also the key technologies such as TCP、BGA、FC、CSP、MCM、3D packaging etc.Which are used for high-density packaging and its future is pointed out.
【CateGory Index】: TN305
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Chinese Journal Full-text Database 2 Hits
1 Ding Liguang(Institute of Machinery,Guangxi Institute of Technology,Liuzhou 545006,China)Ding Wei(Chongqing Jinying NC Equipment Manufacturing Co.Ltd.,Chongqing 401120,China);RESEARCH ON PREVENTING THE INTERNAL STRESS OF RESIN IN ELECTRONIC ENCAPSULATION[J];Engineering Plastics Application;2005-08
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2 YUAN Qin-lu 1, HU Rui 2, LI Jin-shan 2, L Zhen-lin 1 (1. School of Materials Science and Engineering, Xi'an University of Technology, Xi'an 710048,China; 2. State Key Laboratory of Solidification Processing, Northwest Polytechnic University, Xi'an 710072,China);Progress in manufacturing technology of functionally graded materials[J];Ordnance Material Science and Engineering;2003-06
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【Secondary References】
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1 ZHANG Liang1,XUE Song-bai1,YU Sheng-lin1,2,HAN Zong-jie1,GAO Li-li1,LU Fang-yan1,SHENG Zhong1 (1.College of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China;2.The 14th Research Institute,China Electronics Technology Group Corporation,Nanjing 210013,China);Application of FEM analysis in reliability of micro-soldered joints[J];Electric Welding Machine;2008-09
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